US2014360661A1PendingUtilityA1

Connecting and Bonding Adjacent Layers with Nanostructures

52
Assignee: SMOLTEK ABPriority: Sep 12, 2007Filed: Aug 25, 2014Published: Dec 11, 2014
Est. expirySep 12, 2027(~1.2 yrs left)· nominal 20-yr term from priority
Inventors:Mohammad Shafiqul KabirAndrzej Brud
H10W 72/952H10W 72/9415H10W 72/934H10W 72/923H10W 72/59H10W 72/07338H10W 72/351H10W 72/353H10W 72/354H10W 72/325H10W 72/321H10W 90/732H10W 70/664H10W 90/701B32B 2313/04B32B 38/0008Y10T428/24174B32B 37/12B32B 2307/202B32B 37/16B32B 2309/12B32B 2307/302B32B 37/06B32B 2309/02C09J 9/02B32B 2307/706B32B 37/10B32B 2037/1253B32B 2310/0831B32B 2457/00B82Y 10/00
52
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A method of using a bonding film including a plurality of vertically aligned nanostructures embedded in a carrier material, said plurality of vertically aligned nanostructures extending between a top and a bottom surface of the bonding film, for connecting a die to a contacting surface by bonding and creating electrical or thermal contact between the die and the contacting surface, comprising the steps of:
 placing the bonding film between the die and the contacting surface; and   curing the bonding film, wherein the curing causes the die to become bonded to the bonding film and the bonding film to become bonded to the contacting surface, the bonding creating electrical or thermal contacts between the die and the contacting surface via the plurality of vertically aligned nano structures.   
     
     
         2 . The method according to  claim 1 , wherein curing the bonding film causes the carrier material in the bonding film to contract to provide a spring-load force in said nanostructures. 
     
     
         3 . The method according to  claim 1 , wherein said nanostructures are arranged in a matrix configuration in said bonding film. 
     
     
         4 . The method according to  claim 1 , wherein said carrier is an adhesive polymer. 
     
     
         5 . The method according to  claim 1 , wherein said curing takes place through activation of said carrier material by any one of heat, pressure, UV, and any combination thereof 
     
     
         6 . The method according to  claim 1 , wherein said nanostructures are carbon nanostructures. 
     
     
         7 . The method according to  claim 1 , wherein said nanostructures are metal embedded nanostructures.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.