Light source module and backlight unit having the same

Abstract

Disclosed is a light source module capable of realizing a slim structure and providing excellent luminous efficiency. The light source module includes a circuit board, a light emitting diode chip mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a wavelength conversion layer disposed on the light emitting diode chip, and a reflector covering an upper surface and at least one of side surfaces of the light emitting diode chip.

What is claimed is: 
     
         1 . A light source module comprising:
 a circuit board;   a light emitting diode chip mounted on the circuit board by flip-chip bonding or surface mount technology (SMT);   a wavelength conversion layer disposed on the light emitting diode chip; and   a reflector covering an upper surface and at least one of side surfaces of the light emitting diode chip.   
     
     
         2 . The light source module of  claim 1 , wherein one side surface of the light emitting diode chip is defined as an exit face, and the reflector is disposed on the wavelength conversion layer and covers an upper surface and one side surface of the wavelength conversion layer. 
     
     
         3 . The light source module of  claim 1 , wherein the upper surface of the light emitting diode chip is defined as an exit face and the reflector is disposed on each of first and second side surfaces symmetrical to each other among the side surfaces of the light emitting diode chip. 
     
     
         4 . The light source module of  claim 1 , wherein one side surface of the light emitting diode chip is defined as an exit face, the wavelength conversion layer is disposed on the exit face, and the reflector covers the upper surface and the side surfaces of the light emitting diode chip excluding the exit face. 
     
     
         5 . The light source module of  claim 4 , wherein the reflector directly contacts the upper surface and the side surfaces of the light emitting diode chip. 
     
     
         6 . The light source module of  claim 1 , wherein the wavelength conversion layer has a uniform thickness over the entirety thereof. 
     
     
         7 . The light source module of  claim 1 , wherein the upper surface of the light emitting diode chip is defined as an exit face and the wavelength conversion layer has a different thickness in a region covering the exit face than the thickness in other regions thereof. 
     
     
         8 . The light source module of  claim 1 , wherein one side surface of the light emitting diode chip is defined as an exit face, the exit face comprising a first convex-concave section having a convex-concave structure. 
     
     
         9 . The light source module of  claim 8 , wherein the wavelength conversion layer has a convex-concave structure formed on an inner side thereof and corresponding to the first convex-concave section. 
     
     
         10 . The light source module of  claim 8 , wherein the wavelength conversion layer has a second convex-concave section of a convex-concave structure formed on an outer side thereof. 
     
     
         11 . A backlight unit comprising:
 a light guide plate having a flat structure over the entirety thereof; and   a light source module disposed at one side of the light guide plate, the light source module comprising a circuit board, a light emitting diode chip mounted on the circuit board by flip-chip bonding or SMT, a wavelength conversion layer disposed on the light emitting diode chip and a reflector covering an upper surface and at least one of side surfaces of the light emitting diode chip.   
     
     
         12 . The backlight unit of  claim 11 , wherein one surface of the circuit board faces one side surface of the light guide plate and the light emitting diode chip is disposed on the one surface of the circuit board. 
     
     
         13 . The backlight unit of  claim 12 , wherein an upper surface of the light emitting diode chip is defined as an exit face and the reflector is disposed on each of first and second side surfaces symmetrical to each other among the side surfaces of the light emitting diode chip. 
     
     
         14 . The backlight unit of  claim 13 , wherein the wavelength conversion layer has a uniform thickness over the entirety thereof. 
     
     
         15 . The backlight unit of  claim 13 , wherein the wavelength conversion layer has a different thickness in a region covering the exit face than the thickness in other regions thereof. 
     
     
         16 . The backlight unit of  claim 11 , wherein the circuit board is disposed parallel to the light guide plate, the light emitting diode chip is mounted on an upper surface of the circuit board, one side surface of the light emitting diode chip is defined as an exit face, and the exit face faces one side surface of the light guide plate. 
     
     
         17 . The backlight unit of  claim 16 , wherein the reflector is disposed on the wavelength conversion layer and covers an upper surface and one side surface of the wavelength conversion layer. 
     
     
         18 . The backlight unit of  claim 16 , wherein the wavelength conversion layer is disposed on the exit face and the reflector covers the upper surface and the side surfaces of the light emitting diode chip excluding the exit face. 
     
     
         19 . The backlight unit of  claim 16 , wherein the reflector directly contacts the upper surface and the side surfaces of the light emitting diode chip. 
     
     
         20 . The backlight unit of  claim 16 , wherein the exit face comprises a first convex-concave section of a convex-concave structure, the wavelength conversion layer comprises a convex-concave structure formed on an inner side thereof and corresponding to the first convex-concave section, and a second convex-concave section of a convex-concave structure formed on an outer side thereof.