Heating Layer for Film Removal

Abstract

Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.

What is claimed is: 
     
         1 . An applique comprising:
 a protection layer comprising a conductor layer and a dielectric layer;   a heating layer comprising a polymer and magnetic material; and   an adhesive layer.   
     
     
         2 . The applique of  claim 1  wherein the adhesive layer is situated on a bottom surface of the heating layer and is configured to adhere the applique to a mounting surface. 
     
     
         3 . The applique of  claim 1  further comprising:
 a second adhesive layer situated on surface of the heating layer that is adjacent to the protection layer. 
 
     
     
         4 . The applique of  claim 1  wherein the magnetic material is an alloy. 
     
     
         5 . The applique of  claim 4  wherein the alloy is a nickel-iron alloy. 
     
     
         6 . The applique of  claim 1  wherein the magnetic material comprises a magnetic material with a Curie point temperature within a temperature range at which adhesive bonds in the adhesive layer will de-bond. 
     
     
         7 . The applique of  claim 1  wherein the magnetic material further comprises particulate material. 
     
     
         8 . The applique of  claim 7  wherein the particulate material further comprises fiber wire segments. 
     
     
         9 . The applique of  claim 7  wherein the particulate material further comprises material flakes. 
     
     
         10 . The applique of  claim 1  wherein the adhesive layer further comprises a thermosetting film adhesive. 
     
     
         11 . The applique of  claim 1  wherein the adhesive layer further comprises a pressure sensitive adhesive. 
     
     
         12 . The applique of  claim 1  wherein the adhesive layer further comprises a thermoplastic film adhesive. 
     
     
         13 . A system for installation or removal of appliques, the system comprising:
 an applique comprising:
 a surface layer; 
 a heating layer comprising a polymer and magnetic material; and 
 an adhesive layer; and 
   a magnetic field source for generating a variable frequency magnetic field.   
     
     
         14 . The system of  claim 13  wherein the magnetic material comprises a magnetic material with a Curie point temperature within a temperature range at which adhesive bonds in the adhesive layer will de-bond. 
     
     
         15 . The system of  claim 14  wherein the magnetic field source comprises a source that generates a magnetic field selected to cause the magnetic material to reach the Curie point temperature within the temperature range at which the adhesive bonds in the adhesive layer will de-bond. 
     
     
         16 . The system of  claim 14  wherein the magnetic field source comprises a coil that generates a magnetic field in the range of 15-300 KHz. 
     
     
         17 . The system of  claim 13  wherein the surface layer comprises a lightning strike protection layer further comprising a conductor layer and a dielectric layer. 
     
     
         18 . The system of  claim 13  wherein the surface layer comprises a surface protection layer. 
     
     
         19 . The system of  claim 13  wherein the surface layer comprises an aerodynamic effect layer. 
     
     
         20 . A method for manufacturing an applique, the method comprising:
 coupling a surface layer with a heating layer comprising a resin and magnetic material; and   coupling an adhesive layer with the heating layer.   
     
     
         21 . The method of  claim 20  wherein the adhesive layer is coupled with a bottom surface of the heating layer and is configured to adhere the applique to a mounting surface. 
     
     
         22 . The method of  claim 20  further comprising:
 coupling a second adhesive layer on a surface of the heating layer that is adjacent to the surface layer. 
 
     
     
         23 . The method of  claim 20  further comprising including an alloy in the magnetic material. 
     
     
         24 . The method of  claim 23  wherein the alloy that is included in the magnetic material is a nickel-iron alloy. 
     
     
         25 . The method of  claim 20  further comprising including in the heating layer a magnetic material with a Curie point temperature within a temperature range at which adhesive bonds in the adhesive layer de-bond. 
     
     
         26 . The method of  claim 20  further comprising including particulate material into the magnetic material. 
     
     
         27 . The method of  claim 26  wherein the particulate material that is included comprises chopped fiber wire. 
     
     
         28 . The method of  claim 26  wherein the particulate material that is included comprises flaked material.