Component assembly using a temporary attach material

Abstract

A method of attaching a die to a carrier using a temporary attach material is disclosed. The method comprises attaching the temporary attach material between a surface of the die and a surface of the carrier. The temporary attach material attaches the die to the carrier. The method comprises bonding at least one connector to the die and the carrier. The connector includes a first end bonded to the carrier and a second end bonded to the die. The method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.

1 . A method of attaching a die to a carrier using a temporary attach material, the method comprising:
 placing the temporary attach material between a surface of the die and a surface of the carrier, wherein the temporary attach material attaches the die to the carrier;   bonding at least one connector to the die and the carrier, wherein the at least one connector includes a first end bonded to the carrier and a second end bonded to the die;   encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material; and   substantially removing the temporary attach material such that the die is substantially detached from the carrier between at least one surface of the die and one surface of the carrier.   
     
     
         2 . The method of  claim 1 , comprising removing the temporary attach material before encapsulating at least a portion of the die and at least a portion of the at least one connector by the encapsulation material. 
     
     
         3 . The method of  claim 1 , comprising removing the temporary attach material after encapsulating at least a portion of the die and at least a portion of the at least one connector by the encapsulation material. 
     
     
         4 . The method of  claim 1 , comprising removing the temporary attach material through a vent hole within the carrier. 
     
     
         5 . The method of  claim 1 , comprising bonding an other connector to the die and the carrier, wherein the other connector includes an other first end bonded to the carrier and an other second end bonded to the die, wherein the other connector generally opposes the at least one connector. 
     
     
         6 . The method of  claim 1 , wherein the die is suspended over a portion of the carrier by the encapsulation material. 
     
     
         7 . The method of  claim 1 , wherein the temporary attach material is one or more of a water soluble adhesive, a solution of bonding wax in solvent, bonding wax, and a temporary adhesive. 
     
     
         8 . The method of  claim 1 , wherein the connector is an electrical conductor. 
     
     
         9 . A method of attaching a die to a carrier using a temporary attach material, the method comprising:
 placing the temporary attach material between a surface of the die and a surface of the carrier, wherein the temporary attach material attaches the die to the carrier;   bonding a connector to the die and the carrier, wherein the connector includes a first end bonded to the carrier and a second end bonded to the die;   bonding an other connector to the die and the carrier, wherein the other connector includes an other first end bonded to the carrier and an other second end bonded to the die;   applying a glob top to the die to at least partially cover the first end of the connector and the other first end of the other connector, and the second end of connector and the other second end of the other connector;   substantially removing the temporary attach material such that the die is substantially detached from the carrier between at least one die surface and one carrier surface.   
     
     
         10 . The method of  claim 9 , comprising applying the glob top to the die before removal of the temporary attach material. 
     
     
         11 . The method of  claim 9 , comprising applying the glob top to the die after removal of the temporary attach material. 
     
     
         12 . The method of  claim 9 , wherein a second connector generally opposes the first connector. 
     
     
         13 . The method of  claim 9 , wherein the temporary attach material is one or more of a water soluble adhesive, a solution of bonding wax in solvent, bonding wax, and a temporary adhesive. 
     
     
         14 . The method of  claim 9 , wherein the connector is an electrical conductor. 
     
     
         15 . An assembly, comprising:
 a carrier;   a die that is substantially free of a temporary attach material;   at least one connector having a first end bonded to the carrier and a second end bonded to the die; and   an encapsulation material that encapsulates at least a portion of the die and at least a portion of the at least one connector, the encapsulation material suspending the die over a portion of the carrier.   
     
     
         16 . The assembly of  claim 15 , further comprising an other connector that is bonded to the die and the carrier, wherein the other connector includes an other first end bonded to the carrier and an other second end bonded to the die, wherein the other connector generally opposes the at least one connector. 
     
     
         17 . The assembly of  claim 15 , wherein the temporary attach material is one or more of a water soluble adhesive, a solution of bonding wax in solvent, bonding wax, and a temporary adhesive. 
     
     
         18 . The assembly of  claim 15 , wherein the connector is an electrical conductor.