Polishing pad

Abstract

A polishing pad for chemical mechanical polishing includes at least a polishing layer whose polishing surface includes a first groove and a second groove, the first and second grooves have side surfaces, which are continuous with the polishing surface, on each edge in a groove width direction, the first groove has an angle of larger than 105 degrees and 150 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on at least one edge in the groove width direction, and the second groove has an angle of 60 degrees or larger and 105 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on both of two edges in the groove width direction.

1 . A polishing pad for chemical mechanical polishing, the polishing pad comprising at least a polishing layer,
 wherein a polishing surface of the polishing layer includes a first groove and a second groove,   the first and second grooves have side surfaces, which are continuous with the polishing surface, on each edge in a groove width direction,   the first groove has an angle of larger than 105 degrees and 150 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on at least one edge in the groove width direction, and   the second groove has an angle of 60 degrees or larger and 105 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on both of two edges in the groove width direction.   
     
     
         2 . The polishing pad according to  claim 1 , wherein the second groove has a bottom face. 
     
     
         3 . The polishing pad according to  claim 2 , wherein a groove-area ratio per unitary unit is 5% or higher and 50% or lower, and an area occupying ratio of the first groove per groove area is 30% or higher and 90% or lower. 
     
     
         4 . The polishing pad according to  claim 1 , wherein the first and second grooves are formed in a lattice shape. 
     
     
         5 . The polishing pad according to  claim 4 , wherein the sum total of groove lengths of the first grooves formed on the polishing surface is 10% or higher and 90% or lower of the sum total of groove lengths of grooves formed on the polishing surface. 
     
     
         6 . The polishing pad according to  claim 4 , wherein the polishing surface is circular, and the first groove formed on the polishing surface is formed in an area where two straight lines passing through the center of the polishing surface and intersected with each other are included and a distance from at least one of two straight lines is 70% or lower of the radius of the polishing surface. 
     
     
         7 . The polishing pad according to  claim 4 , wherein the first groove has an angle of larger than 105 degrees and 150 degrees or smaller, which is formed between the polishing surface and the side surface continuous with the polishing surface, on both of two edges in the groove width direction.