Reconfigurable bi-stable device

Abstract

A reconfigurable bi-stable device includes an elastically deformable panel laterally disposed between and connected to one or more mounting members directly or indirectly connected to opposing ends of the panel, with the panel maintained under compressive force along at least one vector extending between the opposing ends. The compressive force deforms the panel into a one of two stable deformed positions, with the device disposed such that the panel may be moved between each of the two stable deformed positions by application of manual force to one of two opposing faces of the panel. A first shape memory alloy (SMA) or piezo actuator member is connected to the panel, the actuator member being capable of moving the panel from a first one of the two stable deformed positions to a second one of the two stable deformed positions.

1 . A method of operating a bi-stable device that comprises an elastically deformable panel laterally disposed between and connected to one or more mounting members directly or indirectly connected to opposing ends of the panel, said panel maintained under compressive force along at least one vector extending between said opposing ends, said compressive force deforming the panel into a one of two stable deformed positions, and a first shape memory alloy or piezo actuator member connected to the panel, the method comprising:
 applying heat or electric current to the first shape memory alloy or an electric field to the piezo actuator member to move the panel from a second one of the two stable deformed positions to a first one of the two stable deformed positions.   
     
     
         2 . The method of  claim 1 , further comprising applying manual force to the panel to move the panel from the first of the two stable deformed positions to the second of the two stable deformed positions. 
     
     
         3 . The method of  claim 1 , wherein current is applied to the shape memory alloy or piezo actuator upon the occurrence of a predetermined condition or set of conditions. 
     
     
         4 . The method of  claim 1 , wherein the device further comprises a third shape memory alloy member disposed between and connecting one of the two opposing ends of the panel and a mounting member or disposed between and connecting two mounting members that are movable with respect to each other, the method further comprising applying heat or electric current to the third shape memory alloy member, thereby modifying the amount of force applied manually or by the first shape memory alloy or piezo actuator to move the panel between stable positions. 
     
     
         5 . A method of operating a bi-stable device that comprises an elastically deformable panel laterally disposed between and connected to one or more mounting members directly or indirectly connected to opposing ends of the panel, said panel maintained under compressive force along at least one vector extending between said opposing ends, said compressive force deforming the panel into a one of two stable deformed positions, and, a first shape memory alloy or piezo actuator member connected to the panel, and a second shape memory alloy or piezo actuator member connected to the panel, the method comprising, in any order:
 applying heat or electric current to the first shape memory alloy or an electric field to the piezo actuator member to move the panel from a second one of the two stable deformed positions to a first one of the two stable deformed positions;   optionally applying manual force to the panel to move the panel from the first of the two stable deformed positions to the second of the two stable deformed positions; and   applying heat or electric current to the second shape memory alloy or an electric field to the piezo actuator member to move the panel from the first of the two stable deformed positions to the second of the two stable deformed positions upon the occurrence of a predetermined condition or set of conditions if the panel has not been manually moved from the second one of the two stable deformed positions to the first one of the two stable deformed positions.   
     
     
         6 . The method of  claim 5 , wherein the device further comprises a third shape memory alloy member disposed between and connecting one of the two opposing ends of the panel and a mounting member or disposed between and connecting two mounting members that are movable with respect to each other, the method further comprising applying heat or electric current to the third shape memory alloy member, thereby modifying the amount of force applied manually or by the first shape memory alloy or piezo actuator to move the panel between stable positions.