Method of Manufacturing a Semiconductor Device

Abstract

A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

1 - 16 . (canceled) 
     
     
         17 . A method of manufacturing a semiconductor device, comprising the steps of:
 (a) providing an assembled product, the assembled product including:
 a base material having:
 a plurality of device areas, and 
 a dicing area arranged between the device areas, 
 
 a plurality of semiconductor chips disposed in the device areas, respectively, and 
 a block sealing member sealing the semiconductor chips; 
   (b) after the step (a), disposing the assembled product over a dicer cutting stage via a holding jig, the holding jig including a product support portion having a plurality of through-holes and a groove; and   (c) after the step (b), cutting the base material with a blade along the dicing area of the base material while chucking the block sealing member,   wherein, in the step (b), the assembled product is disposed over the holding jig such that the block sealing member faces and contacts the product support portion, an arrangement of the groove corresponds to the dicing area, and arrangements of the through-holes respectively correspond to the device areas.   
     
     
         18 . The method according to  claim 17 , wherein the holding jig has a plate-like jig body, and the product support portion is fixed on the plate-like jig body. 
     
     
         19 . The method according to  claim 17 , wherein the product support portion is comprised of rubber. 
     
     
         20 . The method according to  claim 18 , wherein the product support portion is comprised of rubber. 
     
     
         21 . The method according to  claim 17 , wherein a plurality of ball electrodes are formed over a surface of the base material, which is opposite to a surface over which the block sealing member is formed. 
     
     
         22 . The method according to  claim 21 , wherein, after the step (a) and before the step (b), the assembled product is held with a jig transfer hand while a plurality of external terminals of the base material are contacted with a sponge of the jig transfer hand. 
     
     
         23 . The method according to  claim 22 , wherein, after the step (a) and before the step (b), the holding jig is held with the jig transfer hand holding the assembled product such that the block sealing member faces and contacts the product support portion. 
     
     
         24 . The method according to  claim 17 , wherein:
 each of the device areas has a plurality of connecting terminals therein;   each of the semiconductor chips has a plurality of pads thereon; and   in each of the device areas, the pads are electrically connected with the connecting terminals via a plurality of wires, respectively.