Printed circuit board and method of fabricating the same

Abstract

Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.

1 . A printed circuit board comprising:
 an insulating layer;   a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer; and   a thermal conductive layer filled in the groove.   
     
     
         2 . The printed circuit board of  claim 1 , wherein a lateral side of the thermal conductive layer makes contact with a lateral side of the copper foil. 
     
     
         3 . The printed circuit board of  claim 1 , wherein the thermal conductive layer has a height equal to a height of the copper foil. 
     
     
         4 . The printed circuit board of  claim 1 , further comprising a solder resist on top surfaces of the copper foil and the thermal conductive layer. 
     
     
         5 . The printed circuit board of  claim 1 , wherein the groove has a width of 1 mm to 2 mm. 
     
     
         6 . A method of fabricating a printed circuit board, the method comprising:
 forming an insulating layer;   forming a circuit pattern including a groove by using a composition used to print the circuit pattern on the insulating layer; and   forming a thermal conductive layer to be filled in the groove.   
     
     
         7 . The method of  claim 6 , wherein the circuit pattern includes a copper foil. 
     
     
         8 . The method of  claim 6 , further comprising forming a solder resist on the circuit pattern. 
     
     
         9 . The method of  claim 8 , wherein the thermal conductive layer is formed through a printing scheme. 
     
     
         10 . A method of fabricating a printed circuit board, the method comprising:
 forming an insulating layer;   forming a circuit pattern including a groove by using a composition used to print the circuit pattern on the insulating layer;   forming a solder resist on the circuit pattern; and   forming a thermal conductive layer to be filled in the groove.   
     
     
         11 . The method of  claim 10 , wherein the groove has a width in a range of 1 mm to 2 mm. 
     
     
         12 . The method of  claim 10 , wherein the thermal conductive layer has a height equal to a height of the solder resist.