Printed circuit board with reduced cross-talk

Abstract

A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

I/we claim: 
     
         1 . A method of manufacturing a multi-layer printed circuit board comprising:
 forming a number of landing pads on an outer layer of the printed circuit board that are electrically connectable to a socket connector;   forming a portion of a ground plane between landing pads that are associated with different signals to be coupled to the connector; and   forming one or more micro vias between the landing pads that are associated with different signals, wherein the micro vias are electrically connected to a ground plane on the outer layer of the circuit board and to a ground plane on an inner layer of the circuit board.