Printed circuit board

Abstract

A printed circuit board comprised of a plurality of interconnected elements, wherein at least two elements to be connected of the printed circuit board are mechanically connected, particularly bonded or glued, with one another on at least one peripheral region thereof, while keeping a distance and being supported on a carrier element.

1 . A printed circuit board comprised of a plurality of interconnected elements, wherein at least two elements to be connected of the printed circuit board are mechanically connected, particularly bonded or glued, with one another on at least one peripheral region thereof, while keeping a distance and being supported on a carrier element. 
     
     
         2 . The printed circuit board according to  claim 1 , wherein the distance between the mutually facing peripheral regions to be connected is selected to be 500 μm at most and, in particular, 200 μm at most. 
     
     
         3 . The printed circuit board according to  claim 1 , wherein elements to be connected are arranged, and connected with one another, with reference to at least one aligning or registering element provided on one of the elements to be connected. 
     
     
         4 . The printed circuit board according to  claim 1 , wherein a thermally or chemically or UV or IR curable adhesive is used for bonding. 
     
     
         5 . The printed circuit board according to  claim 4 , wherein the adhesive is merely introduced or arranged over a portion of the vertical extension of side edges of the peripheral regions to be connected. 
     
     
         6 . The printed circuit board according to  claim 1 , wherein connected elements of a printed circuit board are separable along the interconnected peripheral regions, e.g. for repair purposes, particularly by using a cutter or laser. 
     
     
         7 . The printed circuit board according to  claim 1 , wherein elements to be connected, in a manner known per se, are each formed with at least one relatively complementary coupling element on peripheral regions to be connected. 
     
     
         8 . The printed circuit board according to  claim 7 , wherein the at least one coupling element of an element to be connected is formed by a profiled coupling element projecting from the peripheral region of said element and received in a complementary recess of the element to be connected therewith, while keeping said distance.