Wafer processing apparatus having scroll pump

Abstract

A wafer processing apparatus is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer at a processing position with respect to a processing base. The processing base includes a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer when the wafer contacts the processing fluid while in the processing position. While in contact with the processing fluid, the wafer support may rotate the wafer in the processing fluid. In one embodiment, the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer being processed.

1 . A wafer processing apparatus comprising:
 a wafer support configured to support a wafer; and   a processing base having a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer.   
     
     
         2 . The wafer processing apparatus of  claim 1 , wherein the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer. 
     
     
         3 . The wafer processing apparatus of  claim 1 , wherein the first scroll is fixed and the second scroll oscillates with respect to the first scroll. 
     
     
         4 . The wafer processing apparatus of  claim 3 , wherein the first scroll is configured as the anode. 
     
     
         5 . The wafer processing apparatus of  claim 3 , wherein the processing base includes a motor including a rotor having a cam, wherein the cam is configured to engage a cam follower disposed at a bottom portion of the second scroll to oscillate the second scroll with respect to the first scroll. 
     
     
         6 . The wafer processing apparatus of  claim 1 , wherein the first scroll and second scroll are configured to co-rotate in synchronous motion at offset centers of rotation. 
     
     
         7 . The wafer processing apparatus of  claim 1 , wherein the processing base is configured to selectively provide the processing fluid to the scroll pump from either a fresh supply path or a recirculation supply path. 
     
     
         8 . The wafer processing apparatus of  claim 1 , wherein the processing apparatus is configured to provide at least two different processing fluids to the processing base for executing at least two different processing operations on the wafer. 
     
     
         9 . The wafer processing apparatus of  claim 1 , further comprising a motor configured to rotate the wafer support while contacting the processing fluid in the processing base. 
     
     
         10 . The wafer processing apparatus of  claim 1 , further comprising a motor configured to rotate the wafer support while the wafer is elevated to a fluid spinoff position. 
     
     
         11 . A processing base for a wafer processing apparatus, the processing base comprising:
 a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to a surface of the wafer, wherein the scroll pump includes a first scroll and a second scroll; and   a scroll pump drive configured to operate the scroll pump.   
     
     
         12 . The processing base of  claim 11 , wherein the diameter of the scroll pump is substantially the same as or greater than the diameter of the wafer. 
     
     
         13 . The processing base of  claim 11 , wherein the scroll pump drive comprises a motor including a rotor having a cam, wherein the cam is configured to engage a cam follower disposed at a bottom portion of the second scroll to oscillate the second scroll with respect to the first scroll. 
     
     
         14 . The processing base of  claim 11 , wherein the first scroll and second scroll are configured to co-rotate in synchronous motion at offset centers of rotation. 
     
     
         15 . The processing base of  claim 11 , wherein the processing base includes solution paths configured to selectively provide the processing fluid from a fresh plating supply or recirculated plating supply pumped by the scroll pump. 
     
     
         16 . A method for electroplating a surface of a wafer comprising:
 placing the wafer in a processing position; and   pumping processing fluid in a processing base in a direction substantially perpendicular to the wafer surface using a scroll pump when the wafer is in the processing position.   
     
     
         17 . The method of  claim 16 , further comprising rotating the wafer in the processing fluid while in the processing position. 
     
     
         18 . The method of  claim 16 , further comprising co-rotating scrolls of the scroll pump in synchronous motion at offset centers of rotation. 
     
     
         19 . The method of  claim 16 , further comprising linearly oscillating a first scroll of the scroll pump with respect to a second scroll of the scroll pump.