US2015017466A1PendingUtilityA1
Self-aligned tunable metamaterials
Individually held — no corporate assignee on recordPriority: Mar 9, 2012Filed: Mar 11, 2013Published: Jan 15, 2015
Est. expiryMar 9, 2032(~5.6 yrs left)· nominal 20-yr term from priority
H10P 50/693H10P 50/242B82Y 40/00C30B 33/12C30B 23/025C30B 23/08B32B 15/017Y10T428/12361B82Y 20/00C30B 30/02H01Q 3/01B32B 15/018C30B 29/68Y10T428/24322C30B 19/103C30B 29/66C30B 29/52H01Q 15/0086C09K 13/00C30B 29/06C30B 29/58H01Q 1/24C30B 29/10C23F 1/44C30B 23/02C23F 1/02C23F 1/20C30B 19/06C30B 33/10C30B 19/12H01P 11/00
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Claims
Abstract
A self-aligned tunable metamaterial is formed as a wire mesh. Self-aligned channel grids are formed in layers in a silicon substrate using deep trench formation and a high-temperature anneal. Vertical wells at the channels may also be etched. This may result in a three-dimensional mesh grid of metal and other material. In another embodiment, metallic beads are deposited at each intersection of the mesh grid, the grid is encased in a rigid medium, and the mesh grid is removed to form an artificial nanocrystal.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a metamaterial comprising:
etching a two-dimensional horizontal grid pattern into a substrate block, the two-dimensional grid pattern and depth of the etch being selected for a desired metamaterial property; annealing the substrate to form a plurality of channel grids, each channel grid being characterized by the two-dimensional grid pattern and each channel grid being substantially identical to and vertically aligned with each other channel grid; etching a plurality of vertical wells in the substrate block, each vertical well substantially orthogonally intersecting at least two channel grids; and depositing a first material in the channel grids to form a multi-layer wire mesh.
2 . The method of claim 1 further comprising depositing the first material in the vertical wells.
3 . The method of claim 1 further comprising depositing a second material in the vertical wells.
4 . The method of claim 1 further comprising removing the substrate block.
5 . The method of claim 1 wherein depositing the first material comprises depositing a metal on the edges of the channels whereby hollow metallic tubes are formed.
6 . The method of claim 1 wherein depositing the first material comprises filling the channels with the first material whereby solid wires are formed.
7 . The method of claim 1 wherein the grid pattern is non-rectilinear.
8 . A wire mesh metamaterial constructed according to the process of claim 1 .
9 . The method of claim 1 wherein the operation of depositing a first material in the channel grids precedes the step of etching a plurality of vertical wells and further comprising:
depositing a second material on a plurality of intersecting lines of the first material exposed by the vertical wells;
depositing a third material in the vertical wells;
removing the substrate block;
encasing the multi-layer wire mesh in a rigid medium;
removing the first material; and
back-filling voids in the rigid medium left by the removal of the first material.
10 . An artificial nanocrystal constructed according to the method of claim 9 .
11 . The method of claim 9 wherein depositing the second material comprises electrochemical deposition.
12 . The method of claim 9 wherein the first material and the third material are the same.
13 . The method of claim 9 wherein the first material is aluminum and the second material is gold.
14 . The method of claim 9 wherein etching the vertical wells comprises etching with a fluorechemical process.
15 . An artificial self-aligned nanocrystal comprising a plurality of nanoparticles suspended in a rigid substrate, the nanoparticles arranged to impart to the nanocrystal a characteristic resonant frequency.
16 . The artificial nanocrystal of claim 15 wherein the nanoparticles are gold beads.
17 . The artificial nanocrystal of claim 15 wherein the rigid substrate is a polymer.
18 . A method of manufacturing an artificial nanocrystal comprising:
deeply etching a two-dimensional horizontal grid pattern into a substrate block, the two-dimensional grid pattern and depth of the etch being compatible with an array of beads having a programmed resonant frequency; annealing the substrate to form a plurality of channel grids, each channel grid being characterized by the two-dimensional grid pattern and each channel grid being substantially identical to and vertically aligned with each other channel grid; metallizing the channel grids to form a plurality of two-dimensional wire grids, each wire grid having a plurality of intersections; etching a plurality of vertical wells in the substrate block to expose the intersections, the vertical wells being etched orthogonal to the wire grid and each vertical well being etched at a depth selected to expose at least two intersections; depositing a conductive metal bead on each exposed intersection; filling the vertical wells with a rigid structural medium; and chemically removing the two-dimensional wire grids.
19 . The method of claim 18 further comprising:
chemically removing the substrate block to leave a three-dimensional mesh structure;
encasing the three-dimensional mesh structure in the rigid structural medium;
20 . The method of claim 18 further comprising filling voids left by removal of the wire grid with a rigid structural medium.
21 . The method of claim 18 wherein the two-dimensional grid pattern and the depth of the vertical wells are selected to place the metal beads substantially equidistant from each other throughout the artificial nanocrystal.
22 . An artificial nanocrystal manufactured according to the method of claim 18 .
23 . A method of manufacturing a metamaterial comprising:
etching a two-dimensional horizontal grid pattern into a substrate block, the two-dimensional grid pattern and depth of the etch being selected for a desired metamaterial property; annealing the substrate to form a channel grid, the channel grid being characterized by the two-dimensional grid pattern; and depositing a material in the channel grid to form a single-layer wire mesh.Join the waitlist — get patent alerts
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