Led lighting apparatus and method for fabricating wavelength conversion member for use in the same

Abstract

A method of forming a light-emitting diode (LED) lighting apparatus, including forming an LED on a printed circuit board, and forming a wavelength conversion member on the LED, the wavelength conversion member being spaced apart from the LED. Forming the wavelength conversion member includes transfer molding a wavelength conversion layer on a light-transmitting member, and disposing the wavelength conversion member on the LED, the wavelength conversion layer being disposed between the LED and the light-transmitting member.

What is claimed is: 
     
         1 . A method of forming a light-emitting diode (LED) lighting apparatus, the method comprising:
 forming an LED on a printed circuit board (PCB); and   forming a wavelength conversion member on the LED, the wavelength conversion member being spaced apart from the LED,   wherein forming the wavelength conversion member comprises:
 transfer molding a wavelength conversion layer on a light-transmitting member; and 
 disposing the wavelength conversion member on the LED, the wavelength conversion layer being disposed between the LED and the light-transmitting member. 
   
     
     
         2 . The method of  claim 1 , wherein transfer molding the wavelength conversion layer comprises:
 disposing a mold to cover a first surface of the light-transmitting member, a gap being disposed between the light-transmitting member and the mold; and   performing a transfer molding process, comprising:
 softening a solid molding material, comprising a phosphor and a resin, by heating and pressurizing the solid molding material; and 
 filling the gap between the mold and the light-transmitting member with the softened molding material. 
   
     
     
         3 . The method of  claim 2 , wherein:
 the mold comprises at least one resin injection portion comprising a transfer port and a runner connecting the transfer port and the gap; and   transfer molding the wavelength conversion layer further comprises:
 disposing the solid molding material in the transfer port; 
 pressurizing the solid molding material with a plunger; 
 injecting the softened molding material into the gap, through the runner; and 
   curing the molding material to form the wavelength conversion layer.   
     
     
         4 . The method of  claim 3 , wherein the mold comprises an area equal to or greater than the area of the light-transmitting member. 
     
     
         5 . The method of  claim 4 , further comprising separating the wavelength conversion member from the mold, before disposing the wavelength conversion member on the LED. 
     
     
         6 . The method of  claim 1 , further comprising forming a heat sink on an opposite surface of the PCB than the surface on which the LED is formed. 
     
     
         7 . The method of  claim 6 , wherein the heat sink comprises heat dissipation fins. 
     
     
         8 . The method of  claim 1 , further comprising forming a housing surrounding the LED. 
     
     
         9 . The method of  claim 1 , wherein the light-transmitting member is formed to have an uneven pattern in a portion on which the wavelength conversion layer is disposed. 
     
     
         10 . The method of  claim 1 , wherein the light-transmitting member is formed to have an uneven pattern in a portion on which the wavelength conversion layer is not disposed. 
     
     
         11 . The method of  claim 1 , wherein the light-transmitting member comprises a glass or a plastic material.