Wafer level camera module and method of manufacture

Abstract

A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.

We claim: 
     
         1 . A method of manufacturing a digital camera module, said method comprising:
 providing an integrated circuit chip (ICC) including an image capture sensor array;   providing a first lens with an interlocking feature;   bonding said first lens to a top surface of said ICC;   forming a metallization layer on a side of said ICC opposite said first lens within the perimeter of said ICC;   providing a second lens with a complementary interlocking feature;   engaging said interlocking feature of said first lens with said complementary interlocking feature of said second lens;   bonding said second lens to said first lens; and   coupling one or more additional lenses configured for changing a focus distance of said camera module to said ICC.   
     
     
         2 . The method of  claim 1 , wherein no portion of said first lens and said second lens extend beyond the perimeter of the ICC. 
     
     
         3 . The method of  claim 1 , wherein said step of bonding said first lens to said ICC includes positioning an adhesive sheet between said first lens and said ICC. 
     
     
         4 . The method of  claim 3 , wherein:
 said adhesive sheet defines an aperture over said image sensor array; and   said aperture is at least as large as the larger of a perimeter of said image sensor array and an active portion of said first lens.   
     
     
         5 . The method of  claim 3 , wherein:
 said adhesive sheet is directly adhered to both a top surface of said ICC and a bottom surface of said first lens.   
     
     
         6 . The method of  claim 3 , wherein said adhesive sheet includes opaque material. 
     
     
         7 . The method of  claim 3 , wherein said adhesive sheet includes waterproof material. 
     
     
         8 . The method of  claim 1 , further comprising forming a perimeter wall angled inwardly on said metallization layer, such that the perimeter of said metallization layer does not exceed the perimeter of said ICC. 
     
     
         9 . The method of  claim 1 , wherein:
 said first lens and said second lens form an air gap there between; and   said first lens and said ICC form an air gap there between.   
     
     
         10 . A method of manufacturing digital camera modules, said method comprising:
 providing an image capture device (ICD) wafer including an array of ICDs, each of said ICDs including an imager;   providing a first transparent element array including an array of first lens elements and at least one mechanical interlocking feature, ;   positioning each first lens element over a respective one of said ICDs;   bonding each of said ICDs to a respective one of said first lens elements;   forming a metallization layer on a side of said ICD wafer opposite said first transparent element array;   providing a second transparent element array including an array of second lens elements and at least one complementary mechanical interlocking feature;   positioning said second transparent element array over said first transparent element array, with said mechanical interlocking feature of said first transparent element array engaging said complementary mechanical interlocking feature of said second transparent element array;   bonding said second transparent element array to said first transparent element array; and   dividing said first transparent element array, said second transparent element array, and said ICD wafer to form a plurality of digital camera modules each including one of said ICDs, one of said first lens elements, and one of said second lens elements.   
     
     
         11 . The method of  claim 10 , further comprising backlapping said ICD wafer and first transparent element array. 
     
     
         12 . The method of  claim 10 , wherein said step of bonding said first transparent element array to said ICD includes disposing an adhesive sheet between said first transparent element array and said ICD. 
     
     
         13 . The method of  claim 12 , wherein said adhesive sheet is directly adhered to both a top surface of said ICD wafer and a bottom surface of said first transparent element array. 
     
     
         14 . The method of  claim 12 , wherein:
 said adhesive sheet defines a plurality of apertures, each of said apertures positioned over said imager of a respective one of said ICDs; and   each of said plurality of apertures is at least as large as the larger of a perimeter of said imager of said respective one of said ICDs and a perimeter of a respective one of said lens elements of said first array of transparent elements positioned over said respective one of said ICDs.   
     
     
         15 . The method of  claim 12 , wherein said adhesive sheet includes waterproof material. 
     
     
         16 . The method of  claim 12 , wherein said adhesive sheet includes opaque material. 
     
     
         17 . The method of  claim 10 , wherein:
 said ICD wafer is plasma etched on the side opposite said first transparent element array to form holes for accessing bonding pads and to singulate said ICDs; and   said singulated ICDs are maintained in array form by said first transparent element array.   
     
     
         18 . The method of  claim 17 , further comprising angling each of said plurality of perimeters of said metallization layer inwardly such that each of said perimeters does not exceed the perimeter of said associated one of said ICDs. 
     
     
         19 . The method of  claim 10 , wherein the perimeter of each of said first lens elements and its respective second lens element does not extend beyond the perimeter of its respective ICD. 
     
     
         20 . The method of  claim 10 , wherein:
 each of said first lens elements and said respective second lens element form an air gap there between; and   each of said first lens elements and said respective one of said ICDs form an air gap there between.