US2015027517A1PendingUtilityA1

Method and structure for tiling industrial thin-film solar devices

Assignee: STION CORPPriority: Jan 22, 2010Filed: Oct 14, 2014Published: Jan 29, 2015
Est. expiryJan 22, 2030(~3.5 yrs left)· nominal 20-yr term from priority
H10F 77/939H10F 77/937H10F 19/902H10F 10/167H10F 19/80H01L 31/048Y02E10/541Y02E10/50
70
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Claims

Abstract

A method for integrating photovoltaic module includes providing a cover plate having a first surface and a second surface opposed to the first surface and supplying two or more solar devices respectively formed on substrates. Each of the two or more photovoltaic devices includes a plurality of photovoltaic cells electrically coupled to each other and each cell is characterized by a thin-film photovoltaic layer sandwiched between a first electrode material and a second electrode material. The first electrode material overlies the substrate and the second electrode material overlies the thin-film photovoltaic layer. The method further includes disposing the two or more solar devices side by side to laminate with the cover plate by means of a first organic material filled between the second electrode material and the second surface. Each of the two or more solar devices has a peripheral edge region being sealed by a second organic material. The method further includes electrically coupling the two or more solar devices to each other.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A structure for tiling thin-film solar devices comprising:
 a cover plate with at least a dimension of about 165 cm and greater in one direction including a front surface and a rear surface opposed to the front surface; and   at least two solar devices laminated side by side to the rear surface and electrically coupled to each other by a ribbon connector, each of the solar devices comprising a plurality of thin-film photovoltaic cells overlying a substrate, each of the thin-film photovoltaic cells having a stripe shaped pattern in parallel to each other.   
     
     
         2 . The structure of  claim 1  wherein the cover plate comprises a hardened glass having a transparent region over main areas of the solar devices and an opaque region over the peripheral edge regions of the solar devices. 
     
     
         3 . The structure of  claim 1  wherein the cover plate comprises a transparent polymer. 
     
     
         4 . The structure of  claim 1  the solar devices are attached to the rear surface via a transparent polymer selected from ethylene vinyl acetate and polyvinyl butyral. 
     
     
         5 . The structure of  claim 1  wherein each of the solar devices comprises a peripheral edge region sealed by a polymeric sealant material selected from butyl rubber, urethane and polyurethane materials, polyisobutylene materials, epoxide materials, polysulfamide materials, and cyanoacrylates. 
     
     
         6 . The structure of  claim 1  wherein each of the solar devices comprises a dimension of about 65 cm by 165 cm including the plurality of thin-film photovoltaic cells each having a size of about 6 mm by about 160 cm. 
     
     
         7 . The structure of  claim 1  wherein the plurality of thin-film photovoltaic cells having a stripe shaped pattern comprise a chalcopyrite compound semiconductor materials selected from copper indium diselenide, copper indium disulfide, copper indium gallium diselenide, and copper indium disulfide. 
     
     
         8 . The structure of  claim 1  wherein the ribbon conductor connects the solar devices electrically in series. 
     
     
         9 . The structure of  claim 1  wherein the ribbon conductor connects the solar devices electrically in parallel. 
     
     
         10 . The structure of  claim 1  wherein the ribbon conductor is disposed between the rear surface and the solar devices to connect an electric contact disposed near an edge of the cover plate. 
     
     
         11 . The structure of  claim 1  wherein the ribbon conductor respectively passes through the solar devices to connect an electric contact disposed rear side of the substrates.

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