Device for radiating or receiving electromagnetic waves

Abstract

The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

1 . A device for radiating or receiving an electromagnetic wave, the device comprising:
 a substrate configured to include a recess;   a metal portion configured to radiate or receive the electromagnetic wave; and   an electronic element configured to be connected to the metal portion,   wherein the metal portion includes a portion located above the recess and a portion which is located on the substrate and connected to the electronic element, and   wherein the recess includes the bottom portion configured to reflect the electromagnetic wave.   
     
     
         2 . The device according to  claim 1 , wherein the wall of the recess in the substrate includes a metal layer. 
     
     
         3 . (canceled) 
     
     
         4 . The device according to  claim 1 , wherein the recess is filled with a solid dielectric material having a relative permittivity lower than that of a material forming the substrate. 
     
     
         5 . (canceled) 
     
     
         6 . The device according to  claim 1 , wherein a connection portion between a bottom surface and a side surface of the recess is curved. 
     
     
         7 . (canceled) 
     
     
         8 . The device according to  claim 1 , wherein the electronic element is a rectifying element. 
     
     
         9 . The device according to  claim 1 , wherein a frequency of the electromagnetic wave is in a range from 30 GHz to 30 THz. 
     
     
         10 . (canceled) 
     
     
         11 . The device according to  claim 1 , wherein a connection portion for connecting to an external circuit is provided to a node of an electromagnetic field in the metal portion. 
     
     
         12 . The device according to  claim 11 , wherein the connection portion includes a distributed constant filter. 
     
     
         13 . The device according to  claim 12 , wherein the distributed constant filter is formed by a stub provided on the connection portion. 
     
     
         14 . The device according to  claim 13 , wherein the stub is an L-shaped stub and an end portion of the L-shaped stub faces the metal portion. 
     
     
         15 . The device according to  claim 12 , wherein the distributed constant filter is formed by a periodic structure which is arranged along the connection portion and formed of the same material as that of the substrate. 
     
     
         16 . The device according to  claim 1 , wherein a support portion that supports the metal portion is disposed on a node of an electromagnetic field in the metal portion and the support portion is formed of the same material as that of the substrate. 
     
     
         17 . The device according to  claim 1 , wherein the metal portion includes a slit for adjusting a directivity of an electromagnetic wave. 
     
     
         18 . The device according to  claim 1 , wherein there are at least two nodes of an electromagnetic field in the metal portion with respect to an operating wavelength. 
     
     
         19 . An image sensor comprising:
 a plurality of the devices according to  claim 1 ,   wherein a plurality of the electronic elements is used as an array, and   wherein the image sensor forms an image based on signals from the devices.   
     
     
         20 . (canceled) 
     
     
         21 . The device according to  claim 1 , wherein the electronic element is located on a convex portion ( 1306 ,  1406 ) in the recess. 
     
     
         22 . The device according to  claim 1 , wherein a structure of a metal layer and an insulating layer is located between the substrate and the portion located on the substrate. 
     
     
         23 . The device according to  claim 21 , wherein the convex portion has a bracket shape extending from the edge of the recess. 
     
     
         24 . The device according to  claim 12 , wherein the convex portion has a pillar shape extending from the bottom of the recess. 
     
     
         25 . The device according to  claim 1 , wherein the length of the metal portion located on the substrate is 10% or less than the total length of the metal portion