US2015047821A1PendingUtilityA1

Heating device structure

Assignee: ATOMIC ENERGY COUNCILPriority: Aug 14, 2013Filed: Aug 14, 2013Published: Feb 19, 2015
Est. expiryAug 14, 2033(~7 yrs left)· nominal 20-yr term from priority
H10W 40/10H10F 77/63F28F 21/084F28F 13/00F28F 21/082F28F 3/02H02S 40/42Y02E10/50
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Claims

Abstract

The present relates to a heating device structure, which comprises a heat conducting member to mate with the heat dissipation fins of an electronic device. Thereby, during the packaging process of the electronic device, the effect of multi-point heating can be achieved by combining the heat conducting member and the fins. Accordingly, heating can be performed rapidly to reach the soldering temperature. Without the influence of the structure of heat dissipation fins, the heating process will not be performed at low efficiency.

Claims

exact text as granted — not AI-modified
1 . A heating device structure, used for heating an electronic device having a plurality of fins disposed below said electronic device, comprising:
 a heat-source platform; and   a heat conducting member, disposed on said heat-source platform, comprising:
 a bottom part, contacting said heat-source platform; and 
 a plurality of extension parts, located on said bottom part, extending upwards, and contacting said plurality of fins of said electronic device to be heated. 
   
     
     
         2 . The heating device structure of  claim 1 , wherein said plurality of fins are the heat dissipation unit of said electronic device. 
     
     
         3 . The heating device structure of  claim 1 , wherein the material of said heat conducting member is selected from the group consisting of copper (Cu), aluminum (Al), aluminum-magnesium alloy, aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), boron nitride (BN), graphite (C), steel, and iron (Fe). 
     
     
         4 . The heating device structure of  claim 1 , wherein said electronic device is a photovoltaic-cell module receiver. 
     
     
         5 . The heating device structure of  claim 1 , wherein the material of said plurality of fins is selected from the group consisting of copper (Cu), aluminum (Al), aluminum-magnesium alloy, aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), boron nitride (BN), graphite (C), steel, and iron (Fe). 
     
     
         6 . The heating device structure of  claim 1 , wherein said plurality of extension parts contact the inner sides of said plurality of fins.

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