Chemical Mechanical Polishing Conditioner Made From Woven Preform

Abstract

The present invention relates to a chemical mechanical polishing conditioner made from a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and solve the conventional problem of resin residue in a powder-form bonding layer, or thermal cracking or thermal deformation of a sheet-form bonding layer during the heating and curing process, and thus improve the polishing performance and service time of the chemical mechanical polishing conditioner.

What is claimed is: 
     
         1 . A chemical mechanical polishing conditioner made from a woven preform, comprising:
 a substrate;   a bonding layer disposed on the substrate; and   a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer;   wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance.   
     
     
         2 . The chemical mechanical polishing conditioner of  claim 1 , wherein the melting point of the woven preform is below the heat-curing temperature. 
     
     
         3 . The chemical mechanical polishing conditioner of  claim 1 , wherein the woven preform has a first directional woven matrix and a second directional woven matrix. 
     
     
         4 . The chemical mechanical polishing conditioner of  claim 3 , wherein a woven space is formed between the first directional woven matrix and the second directional woven matrix adjacent thereto. 
     
     
         5 . The chemical mechanical polishing conditioner of  claim 4 , wherein a maximum diameter of the woven space is 0.1 to 5 times a diameter of the abrasive particles. 
     
     
         6 . The chemical mechanical polishing conditioner of  claim 4 , wherein the woven space contains one to five of the abrasive particles. 
     
     
         7 . The chemical mechanical polishing conditioner of  claim 4 , wherein the abrasive particles are disposed on a surface of the woven preform, or the abrasive particles are disposed in the woven space of the woven preform. 
     
     
         8 . The chemical mechanical polishing conditioner of  claim 7 , wherein the abrasive particles have a patterned arrangement or an irregular arrangement. 
     
     
         9 . The chemical mechanical polishing conditioner of  claim 3 , wherein an included angle between the first directional woven matrix and the second directional woven matrix is 10 to 90 degrees. 
     
     
         10 . The chemical mechanical polishing conditioner of  claim 9 , wherein an included angle between the first directional woven matrix and the second directional woven matrix is 90 degrees. 
     
     
         11 . The chemical mechanical polishing conditioner of  claim 3 , wherein the woven preform further comprises a third directional woven matrix and a fourth directional woven matrix. 
     
     
         12 . The chemical mechanical polishing conditioner of  claim 1 , wherein the woven preform is a single-layer woven structure or a multilayer woven structure. 
     
     
         13 . The chemical mechanical polishing conditioner of  claim 1 , wherein the abrasive particles are artificial diamond, nature diamond, polycrystalline diamond or cubic boron nitride. 
     
     
         14 . The chemical mechanical polishing conditioner of  claim 1 , wherein the abrasive particles have a particle size of 30 to 600 μm. 
     
     
         15 . The chemical mechanical polishing conditioner of  claim 1 , wherein a composition of the bonding layer or the woven preform is made of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymer material. 
     
     
         16 . The chemical mechanical polishing conditioner of  claim 15 , wherein the ceramic material is a glass fiber, or a carbon fiber. 
     
     
         17 . The chemical mechanical polishing conditioner of  claim 15 , wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and combinations thereof. 
     
     
         18 . The chemical mechanical polishing conditioner of  claim 15 , wherein the polymer material is epoxy resin, polyester resin, polyacrylic resin, phenolic resin. 
     
     
         19 . The chemical mechanical polishing conditioner of  claim 1 , wherein the substrate is made of stainless steel. 
     
     
         20 . The chemical mechanical polishing conditioner of  claim 1 , wherein the substrate surface is a planar surface, a convex surface, or a concave surface.