Led chip package

Abstract

An LED chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the LED chip for reflecting light beams from the LED chips; the glass coating further extends to cove the inner wall surface of the circular wall. The larger area the glass coating covers, the more heat the package dissipates in a time unit. The LED chip package according to the present invention exhibits higher thermal dissipation and helps to last longer the life of the LED chip package than a traditional one.

What is claimed is: 
     
         1 . An LED chip package, comprising:
 an LED chip; has a first top electrode and a second top electrode;   a middle copper nugget, carrying the LED chip;   a left copper nugget;   a right copper nugget;   a first metal wire, electrically coupling the first top electrode to the left copper nugget;   a second metal wire, electrically coupling the second top electrode to the right copper nugget; and   a topographical glass coating, covering the surface of the bonding wires, the top surface of the LED chip, and the exposed top surface of the copper nuggets.   
     
     
         2 . The LED chip package as claimed in  claim 1 , further comprising:
 a circular wall, surrounding the LED chip and the bonding wires; wherein the topographical glass coating, covering the top surface of an area surrounded by the circular wall.   
     
     
         3 . The LED chip package as claimed in  claim 2 , wherein the topographical glass coating, further extending to cover the inner wall surface of the circular wall. 
     
     
         4 . An LED chip package, comprising:
 a left copper nugget;   a right copper nugget;   an LED chip, having a first bottom electrode and a second bottom electrode; straddles over the left copper nugget and the right copper nugget; wherein the first bottom electrode electrically coupled to the left copper nugget, and the second bottom electrode electrically coupled to the right copper nugget, and   a topographical glass coating, covering the top surface of the LED chip and the exposed top surface of the copper nuggets.   
     
     
         5 . The LED chip package as claimed in  claim 4 , further comprising:
 a circular wall, surrounding the LED chip; and   the topographical glass coating further extending to cover the inner wall surface of the circular wall.   
     
     
         6 . The LED chip package as claimed in  claim 1 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         7 . An LED chip package, comprising:
 a ceramic substrate;   a left metal pad, configured on a top surface of the ceramic substrate;   a right metal pad; configured on a top surface of the ceramic substrate;   an LED chip, having a first top electrode and a second top electrode;   a first metal wire, electrically coupling the first top electrode to the left copper metal pad  41 ; and   a second metal wire, electrically coupling the second top electrode to the right metal pad.   a topographical glass coating, covering the top surface of the LED chip, metal pads, and the exposed top surface of the ceramic substrate.   
     
     
         8 . The LED chip package as claimed in  claim 7 , further comprising:
 a circular wall, surrounding the LED chip and the bonding wires; and   the topographical glass coating further extending to cover the inner wall surface of the circular wall.   
     
     
         9 . The LED chip package as claimed in  claim 7 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         10 . An LED chip package, comprising:
 a ceramic substrate  30 ;   a left metal pad, configured on a top surface of the ceramic substrate;   a right metal pad; configured on a top surface of the ceramic substrate;   an LED chip, straddles over the left metal pad and the right metal pad;   a topographical glass coating, covering the top surface of the LED chip, metal pads and the exposed top surface of the ceramic substrate.   
     
     
         11 . The LED chip package as claimed in  claim 10 , further comprising:
 a circular wall, surrounding the LED chip and the metal pads; and   
       the topographical glass coating further extending to cover the inner wall surface of the circular wall. 
     
     
         12 . The LED chip package as claimed in  claim 10 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         13 . An LED chip package, comprising:
 a MCPCB substrate, having a metal core and a dielectric layer configured on a top surface of the metal core;   a left metal pad, configured on a top surface of the dielectric layer;   a right metal pad; configured on a top surface of the dielectric layer;   an LED chip, having a first top electrode and a second top electrode;   a first metal wire, electrically coupling the first top electrode to the left metal pad; and   a second metal wire, electrically coupling the second top electrode to the right metal pad; and   a topographical glass coating, covering the bonding wires, the top surface of the LED chip, and the exposed top surface of the dielectric layer.   
     
     
         14 . The LED chip package as claimed in  claim 13 , further comprising:
 a circular wall, surrounding the LED chip and the metal pads; and   
       the topographical glass coating further extending to cover the inner wall surface of the circular wall. 
     
     
         15 . The LED chip package as claimed in  claim 13 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         16 . An LED chip package, comprising:
 a MCPCB substrate, having a metal core, and a dielectric layer on a top surface of the metal core;   a left metal pad, configured on a top surface of the dielectric layer;   a right metal pad; configured on a top surface of the dielectric layer;   an LED chip, straddles over the left metal pad and the right metal pad; and   a topographical glass coating, covering the top surface of the LED chip, metal pads and the exposed top surface of the dielectric layer.   
     
     
         17 . The LED chip package as claimed in  claim 16 , further comprising:
 a circular wall, surrounding the LED chip and the metal pads; and   
       the topographical glass coating further extending to cover the inner wall surface of the circular wall. 
     
     
         18 . The LED chip package as claimed in  claim 16 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         19 . A wafer with a topographical glass coating on top surface, comprising:
 a wafer; and   a topographical glass coating, covering the top surface of the wafer.   
     
     
         20 . The wafer as claimed in  claim 19 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         21 . A chip with a topographical glass coating on top surface, comprising:
 a chip; and   a topographical glass coating, covering the top surface of the chip; wherein the topographical glass coating has a vertical edge flushed with a vertical edge of the chip.   
     
     
         22 . The chip with a topographical glass coating on top surface as claimed in  claim 21 , wherein the topographical glass coating containing a material selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide, aluminum oxynitride, and silica carbon nitride. 
     
     
         23 . A process for preparing a topographically glass-coated chip, comprising:
 preparing a wafer; and   performing a topographical glass coating over the wafer.   
     
     
         24 . A process for preparing a topographically glass-coated chip as claimed in  claim 23 , further comprising:
 dicing the wafer to yield a plurality of chips with a topographical glass coating on top surface.   
     
     
         25 . The topographically glass-coated chip prepared according to  claim 24 , wherein
 the topographical glass coating, having four vertical sides; and   the chip, having four vertical sides; wherein   each vertical side of the topographical glass coating is flushed with a corresponding vertical side of the chip.   
     
     
         26 . A process for preparing a topographically glass-coated chip, comprising:
 preparing a chip on a dicing tap; and   performing a topographical glass coating over the chip.   
     
     
         27 . The topographically glass-coated chip prepared according to  claim 26 , wherein the topographical glass coating, covering both the top surface of the chip and the four vertical side.