Method of manufacturing gold thin film by using electroless-plating method
Abstract
Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device.
Claims
exact text as granted — not AI-modified1 . A method of manufacturing a gold (Au) thin film by using an electroless-plating method, the method comprising:
manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture in the temperature range of 50˜70° C.
2 . The method of claim 1 , wherein the alcohol-water mixed solution is a mixed solution containing 70 to 90 wt % of alcohol and 30 to 10 wt % of water.
3 . The method of claim 1 , wherein the alcohol is C1 to C4 alcohol.
4 . The method of claim 1 , wherein the Au chloride compound is selected from the group consisting of potassium Au chloride (KAuCl4), gold potassium cyanide (KAu(CN)2), and chloroauric acid (HAuCl4).
5 . The method of claim 1 , wherein the alkaline compound is selected from the group consisting of potassium carbonate, sodium hydroxide, potassium hydroxide, butylamine, and sodium hydrogen carbonate.
6 . The method of claim 1 , wherein the substrate is formed of a dielectric material selected from the group consisting of glass, plastic, and silicon.
7 . The method of claim 2 , wherein the alcohol is C1 to C4 alcohol.Cited by (0)
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