Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids

Abstract

Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

1 - 22 . (canceled) 
     
     
         23 . A method of processing a microelectronic workpiece, comprising the steps of:
 a) positioning the workpiece in a processing chamber;   b) causing a barrier structure to overlie and cover the workpiece in a manner effective to help provide a tapering flow channel proximal to a major surface of the workpiece that tapers in a radially outward direction relative to said surface; and   c) while the workpiece is positioned in the processing chamber and covered by the barrier structure, causing at least one processing material to flowingly contact said major surface of the workpiece.   
     
     
         24 - 31 . (canceled) 
     
     
         32 . A nozzle device comprising:
 a) a first nozzle structure through which one or more processing materials independently are atomizingly dispensed downward onto a workpiece surface across at least a portion of a radius of the workpiece surface;   b) a second nozzle structure through which one or more processing materials independently are dispensed onto a central portion of the workpiece surface;   c) a third nozzle structure through which one or more processing materials are independently introduced into a headspace above the workpiece surface; and   wherein the first, second and third nozzle structures are physically coupled in a manner such that the first, second, and third nozzle structures are moveable relative to the workpiece surface.   
     
     
         33 . The nozzle device of  claim 32 , wherein the first, second, and third nozzle structures are moveable together. 
     
     
         34 . The nozzle device of  claim 32 , wherein at least one of the nozzle structures is moveable in a z-axis relative to the workpiece surface. 
     
     
         35 . An apparatus for processing a microelectronic workpiece, comprising:
 a) a processing chamber in which the workpiece is positioned during a process;   b) a moveable member comprising a tube portion having a through bore, said moveable member being positioned over the workpiece and being moveable relative to a major surface of the workpiece;   c) at least one independent nozzle structure physically coupled to the moveable member such that movement of the moveable member allows the relative spacing between the major surface of the workpiece and the nozzle structure to be controllably adjusted; and   d) at least a portion of at least one fluid supply pathway in the through bore of the tube portion fluidly coupled to the at least one independent nozzle structure and workpiece.   
     
     
         36 - 45 . (canceled)