Organic el device and manufacturing method therefor

Abstract

In an organic EL device, a risk of a short circuit between adjacent terminals in a connection space on a substrate can be reduced. An organic EL device includes a substrate, one or a plurality of organic EL elements formed on the substrate, a plurality of connection terminals provided on the substrate and electrically connected to electrodes of the organic EL elements, an insulating cover layer that covers the connection terminals and the substrate between the connection terminals, and a mounted component mounted via an anisotropic conducive layer and including terminals to be connected electrically connected to the connection terminals. The anisotropic conductive layer includes conductive particulates that electrically connect the connection terminals and the terminals to be connected. The conductive particulates electrically connect the connection terminals and the terminals to be connected piercing through the cover layer.

What is claimed is: 
     
         1 . An organic EL device comprising:
 a substrate;   one or a plurality of organic EL elements formed on said substrate;   a plurality of connection terminals provided on said substrate and electrically connected to electrodes of said organic EL elements;   an insulating cover layer covering said connection terminals and said substrate between said connection terminals; and   a mounted component mounted via an anisotropic conducive layer and including terminals to be connected electrically to said connection terminals, wherein   said anisotropic conductive layer includes conductive particulates that electrically connect said connection terminals and said terminals to be connected, and   said conductive particulates electrically connect said connection terminals and said terminals to be connected piercing through said cover layer.   
     
     
         2 . The organic EL device according to  claim 1 , wherein said anisotropic conductive layer includes an insulating joining layer that physically joins said substrate and said mounted component, and said conductive particulates are dispersed in said joining layer. 
     
     
         3 . The organic EL device according to  claim 2 , wherein, due to compression bonding of said substrate and said mounted component, said conductive particulates pierce through said cover layer and electrically connect said connection terminals and said terminals to be connected. 
     
     
         4 . The organic EL device according to  claim 3 , wherein said connection terminals and said cover layer are arranged in a connection space in which said substrate and said mounted components are connected. 
     
     
         5 . The organic EL device according to  claim 4 , wherein said cover layer is formed by a sealing film that seals said organic EL element between said sealing film and said substrate. 
     
     
         6 . The organic EL device according to  claim 5 , wherein said cover layer includes an inorganic substance. 
     
     
         7 . The organic EL device according to  claim 6 , wherein said cover layer includes an aluminum oxide film. 
     
     
         8 . The organic EL device according to  claim 5 , wherein said cover layer is a layer formed by atomic layer deposition (ALD). 
     
     
         9 . The organic EL device according to  claim 3 , wherein said anisotropic conductive layer is a thermo-compression bonding anisotropic conductive film. 
     
     
         10 . The organic EL device according to  claim 2 , wherein said joining layer of said anisotropic conductive layer is light curing resin. 
     
     
         11 . The organic EL device according to  claim 1 , wherein a diameter of said conductive particulate is larger than thickness of said cover layer. 
     
     
         12 . The organic EL device according to  claim 11 , wherein said conductive particulate has corners on a surface or in an entire shape. 
     
     
         13 . The organic EL device according to  claim 1 , wherein said connection terminal is a laminated structure of a plurality of layers. 
     
     
         14 . A manufacturing method for an organic EL device comprising:
 a step of forming an organic EL element on a substrate and forming, in a connection space on said substrate, a connection terminal connected to an electrode of said organic EL element;   a step of forming an insulating cover layer covering said connection terminal and said substrate in said connection space; and   a mounting step of mounting a mounted component in said connection space via an anisotropic conductive layer, wherein   in said mounting step, with said substrate and said mounted components being compression-bonded, conductive particulates of said anisotropic conductive layer electrically connect said connection terminal and a terminal to be connected of said mounted component piercing through said cover layer.   
     
     
         15 . A manufacturing method for an organic EL device comprising:
 a step of forming an organic EL element on a substrate and forming, in a connection space on said substrate, a connection terminal connected to an electrode of said organic EL element;   a step of forming an insulating cover layer that covers said connection terminals and said substrate in said connection space by forming a sealing film that seals said organic EL element between said sealing film and said substrate with said sealing film,; and   a mounting step of mounting a mounted component in said connection space via an anisotropic conductive layer, wherein   in said mounting step, with said substrate and said mounted components being compression-bonded, conductive particulates of said anisotropic conductive layer electrically connect said connection terminal and a terminal to be connected of said mounted component piercing through said cover layer   
     
     
         16 . An organic EL device comprising:
 a substrate;   one or a plurality of organic EL elements formed on said substrate;   a plurality of connection terminals provided on said substrate and electrically connected to electrodes of said organic EL elements;   a sealing film formed by atomic layer deposition (ALD), said sealing film sealing said organic EL elements and said plurality of terminals; and   a mounted component mounted via an anisotropic conducive layer and including terminals to be connected electrically to said connection terminals, wherein   said anisotropic conductive layer includes conductive particulates having a diameter larger than a diameter of said sealing film, said conductive particulates electrically connecting said connection terminals and said terminals to be connected, and   said plurality of connection terminals and said conductive particulates come into contact with each other piercing through said sealing film.   
     
     
         17 . The organic EL device according to  claim 1 , wherein said sealing film is formed over said entire substrate.