Photocurable material for sealing, sealing method, sealing material, and housing using said sealing material

Abstract

A photocurable material for sealing including (A) an oligomer having a weight average molecular weight of 10,000 to 30,000 and having (meth)acryloyl group(s), (B) a (meth)acrylate monomer, (C) a polythiol compound, and optionally (D) a carbodiimide compound enables the provision of a sealing material that has high compression recovery performance, high tensile strength and excellent flexibility, can have low hardness if required, and therefore has excellent sealing properties including air-tightness performance and water-proof performance and undergoes the formation of little surface tacks and the like.

1 . A method of stabilizing an ene-thiol-type photocurable resin material, comprising adding a carbodiimide compound to the ene-thiol-type photocurable resin material. 
     
     
         2 . The method of  claim 1 , wherein the carbodiimide compound is an aliphatic polycarbodiimide compound having multiple —N═C═N— groups. 
     
     
         3 . The method of  claim 1 , wherein the carbodiimide compound is a compound represented by the formula: R 12 —(—N═C═N—R 11 —) m —R 13  
 wherein R 11  may be the same as or different from each other and is independently a bivalent aromatic group and/or a bivalent aliphatic group; 
 when R 11  is an aromatic oligomeric carbodiimide or an aromatic polymeric carbodiimide, R 11  may be substituted with an aliphatic substituent and/or an alicyclic substituent and/or an aromatic substituent each having at least one carbon atom, wherein the substituent may have a hetero atom and the substitution by the substituent may occur at least one ortho-position in an aromatic group to which the carbodiimide group is bound; 
 R 12  is C 1-18  alkyl, C 5-18  cycloalkyl, aryl, C 7-18  aralkyl, —R 11 —NH—COS—R 14 , —R 11 COOR 14 , —R 11 —OR 14 , —R 11 —N(R 14 ) 2 , —R 11 —SR 14 , —R 11 —OH, R 11 —NH 2 , —R 11 —NHR 14 , —R 11 -epoxy, —R 11 —NCO, —R 11 —NHCONHR 14 , —R 11 —NHCONR 14 R 15  or —R 11 —NHCOOR 16 ; 
 R 13  is —N═C═N-aryl, —N═C═N-alkyl, —N═C═N-cycloalkyl, —N═C═N-aralkyl, —NCO, —NHCONHR 14 , —NHCONHR 14 R 15 , —NHCOOR 16 , —NHCOS—R 14 , —COOR 14 , —OR 14 , epoxy, —N(R 14 ) 2 , —SR 14 , —OH, —NH 2  or —NHR 14 ; 
 R 14  and R 15  may be the same as or different from each other, and are independently C 1-20  alkyl, C 3-20  cycloalkyl, C 7-18  aralkyl, an oligo/polyethylene glycol, and/or an oligo/polypropylene glycol; 
 R 16  has one of the variables defined for R 14  or is a polyester group or a polyamide group; and 
 m is 1 to 5. 
 
     
     
         4 . The method of  claim 1 , wherein a carbodiimide compound is contained in an amount of 0.1 to 15 parts by weight relative to 100 parts by weight of an oligomer having a (meth)acryloyl group in the ene-thiol-type photocurable resin material. 
     
     
         5 . The method of  claim 1 , wherein a carbodiimide compound is contained in an amount of 0.5 to 12 parts by weight relative to 100 parts by weight of an oligomer having a (meth)acryloyl group in the ene-thiol-type photocurable resin material. 
     
     
         6 . The method of  claim 1 , wherein a carbodiimide compound is contained in an amount of 1 to 10 parts by weight relative to 100 parts by weight of an oligomer having a (meth)acryloyl group in the ene-thiol-type photocurable resin material.