High modulus urethane adhesive compositions, manufacture and use thereof

Abstract

The invention relates to a urethane adhesive composition having high modulus and is pump transferable at room temperature.

1 . A urethane adhesive composition comprising
 a) more than about 25 wt. % of a urethane prepolymer resin;   b) more than about 0.25 wt. % of polyisocyanate;   c) more than about 0.1 wt % of an organic amine and/or more than about 60 ppm of an organo metallic catalyst compound; and   d) a filler.   
     
     
         2 . The composition according to  claim 1  comprising more than about 0.5 wt. % of polyisocyanate. 
     
     
         3 . The composition according to  claim 2  comprising more than about 1 wt. % of a polyisocyanate. 
     
     
         4 . The composition according to  claim 1  comprising no more than about 7.5 wt. % of a polyisocyanate. 
     
     
         5 . The composition according to  claim 4  comprising no more than about 5 wt. % of a polyisocyanate. 
     
     
         6 . The composition according to  claim 5  comprising no more than about 3 wt. % of a polyisocyanate. 
     
     
         7 . The composition of  claim 1  wherein the polyisocyanate comprises an aromatic polyisocyanate with a nominal functionality of more than 2.5.