US2015089961A1PendingUtilityA1

Temperature-Controlled Storage Module

42
Assignee: DUZLY YACOVPriority: Sep 30, 2013Filed: Sep 30, 2013Published: Apr 2, 2015
Est. expirySep 30, 2033(~7.2 yrs left)· nominal 20-yr term from priority
Inventors:Yacov DuzlyAlon Marcu
H10W 74/00G06F 13/1668F25B 2321/021F25B 21/04G11C 7/04
42
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Claims

Abstract

A temperature-controlled storage module is disclosed. In one embodiment, a storage module is provided comprising a memory, a temperature sensor, a thermoelectric cooler, and a controller. The controller compares a temperature reading from the temperature sensor to a target temperature. If the temperature reading differs from the target temperature, the controller activates the thermoelectric cooler. For example, if the temperature reading is higher than the target temperature, the thermoelectric cooler can be activated to cool the memory. This allows the memory (e.g., NAND die(s)) to operate in a narrow range of temperatures providing better system tradeoffs on memory (e.g., NAND) characteristics.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A storage module comprising:
 a memory;   a temperature sensor;   a thermoelectric cooler; and   a controller in communication with the memory, the temperature sensor, and the thermoelectric cooler, wherein the controller is configured to:
 compare a temperature reading from the temperature sensor to a target temperature; and 
 if the temperature reading differs from the target temperature, activate the thermoelectric cooler. 
   
     
     
         2 . The storage module of  claim 1 , wherein the target temperature is predetermined. 
     
     
         3 . The storage module of  claim 1 , wherein the target temperature is adjustable by a user of the storage module. 
     
     
         4 . The storage module of  claim 1 , wherein the target temperature is a single temperature. 
     
     
         5 . The storage module of  claim 1 , wherein the target temperature is a temperature range. 
     
     
         6 . The storage module of  claim 1 , wherein if the temperature reading is higher than the target temperature, the controller activates the thermoelectric cooler to cool the memory. 
     
     
         7 . The storage module of  claim 6 , wherein if the temperature reading is lower than the target temperature, the controller activates the thermoelectric cooler to heat the memory. 
     
     
         8 . The storage module of  claim 1 , wherein the memory comprises a memory die and a substrate, and wherein the thermoelectric cooler is located between the memory die and the substrate. 
     
     
         9 . The storage module of  claim 8  further comprising a printed circuit board and a plurality of solder balls thermally and electrically coupling the substrate with the printed circuit board. 
     
     
         10 . The storage module of  claim 1 , wherein the memory comprises a plurality of memory dies, wherein the storage module comprises an additional thermoelectric cooler, and wherein the plurality of memory dies are located between the thermoelectric cooler and the additional thermoelectric cooler. 
     
     
         11 . The storage module of  claim 1  further comprising packaging housing the controller and the memory, and wherein the thermoelectric cooler is internal to the packaging. 
     
     
         12 . The storage module of  claim 1  further comprising packaging housing the controller and the memory, and wherein the thermoelectric cooler is external to the packaging. 
     
     
         13 . The storage module of  claim 1 , wherein the temperature sensor is located in the memory. 
     
     
         14 . The storage module of  claim 1 , wherein the temperature sensor is located in the controller. 
     
     
         15 . The storage module of  claim 1 , wherein the memory is divided into a plurality of regions, each associated with a different target temperature, and wherein the thermoelectric cooler is divided into a corresponding plurality of regions that are independently controlled by the controller. 
     
     
         16 . The storage module of  claim 1 , wherein the storage module is embedded in a host. 
     
     
         17 . The storage module of  claim 1 , wherein the storage module is removably connected to a host. 
     
     
         18 . The storage module of  claim 1 , wherein the memory is a NAND memory. 
     
     
         19 . The storage module of  claim 1 , wherein the storage module is a solid-state drive. 
     
     
         20 . A storage module comprising:
 a substrate;   a memory die;   a thermoelectric cooler located between the memory die and the substrate; and   packaging that houses the substrate, memory die, and thermoelectric cooler.   
     
     
         21 . The storage module of  claim 20  further comprising a second thermoelectric cooler located on an other side of the memory die. 
     
     
         22 . The storage module of  claim 21  further comprising at least one additional memory die located between the memory die and the second thermoelectric cooler. 
     
     
         23 . The storage module of  claim 20  further comprising a controller located on an other side of the memory die. 
     
     
         24 . The storage module of  claim 23  further comprising at least one additional memory die located between the memory die and the controller. 
     
     
         25 . The storage module of  claim 20  further comprising a controller located between the memory die and the thermoelectric cooler. 
     
     
         26 . The storage module of  claim 20 , wherein the storage module is embedded in a host. 
     
     
         27 . The storage module of  claim 20 , wherein the storage module is removably connected to a host. 
     
     
         28 . The storage module of  claim 20 , wherein the memory die is a NAND memory die. 
     
     
         29 . The storage module of  claim 20 , wherein the storage module is a solid-state drive. 
     
     
         30 . A method of controlling temperature of a storage module, the method comprising:
 performing the following in a memory module having a memory, a temperature sensor, and a thermoelectric cooler:
 comparing a temperature reading from the temperature sensor to a target temperature; and 
 if the temperature reading differs from the target temperature, activating the thermoelectric cooler. 
   
     
     
         31 . The method of  claim 30 , wherein the target temperature is predetermined. 
     
     
         32 . The method of  claim 30 , wherein the target temperature is adjustable by a user of the storage module. 
     
     
         33 . The method of  claim 30 , wherein the target temperature is a single temperature. 
     
     
         34 . The method of  claim 30 , wherein the target temperature is a temperature range. 
     
     
         35 . The method of  claim 30 , wherein if the temperature reading is higher than the target temperature, the thermoelectric cooler is activated to cool the memory. 
     
     
         36 . The method of  claim 35 , wherein if the temperature reading is lower than the target temperature, the thermoelectric cooler is activated to heat the memory. 
     
     
         37 . The method of  claim 30 , wherein the memory comprises a memory die and a substrate, and wherein the thermoelectric cooler is located between the memory die and the substrate. 
     
     
         38 . The method of  claim 37  further comprising a printed circuit board and a plurality of solder balls thermally and electrically coupling the substrate with the printed circuit board. 
     
     
         39 . The method of  claim 30 , wherein the memory comprises a plurality of memory dies, wherein the storage module comprises an additional thermoelectric cooler, and wherein the plurality of memory dies are located between the thermoelectric cooler and the additional thermoelectric cooler. 
     
     
         40 . The method of  claim 30 , wherein the storage module comprises packaging housing the controller and the memory, and wherein the thermoelectric cooler is internal to the packaging. 
     
     
         41 . The method of  claim 30 , wherein the storage module comprises packaging housing the controller and the memory, and wherein the thermoelectric cooler is external to the packaging. 
     
     
         42 . The method of  claim 30 , wherein the temperature sensor is located in the memory. 
     
     
         43 . The method of  claim 30 , wherein the temperature sensor is located in the controller. 
     
     
         44 . The method of  claim 30 , wherein the memory is divided into a plurality of regions, each associated with a different target temperature, and wherein the thermoelectric cooler is divided into a corresponding plurality of regions that are independently controlled by the controller. 
     
     
         45 . The method of  claim 30 , wherein the storage module is embedded in a host. 
     
     
         46 . The method of  claim 30 , wherein the storage module is removably connected to a host. 
     
     
         47 . The method of  claim 30 , wherein the memory is a NAND memory. 
     
     
         48 . The method of  claim 30 , wherein the storage module is a solid-state drive.

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