Molding apparatus and process

Abstract

A molding process ( 100 ) comprising the step of inserting an uncured blank ( 102 ) in a mold cavity ( 14 ) formed in a mold system, the uncured blank including fiber and uncured binder, transferring heat from the mold system to a cool pressurized gas ( 108 ) to establish a hot pressurized gas, injecting the hot pressurized gas into the mold cavity ( 110 ), and transferring heat ( 112 ) from the hot pressurized gas to the uncured blank to cause the uncured binder to cure and establish a cured product ( 114 ).

1 . A mold system comprising
 a first mold unit and   a second mold unit coupled to the first mold unit to move relative to the first mold unit between a closed position in which a mold cavity is defined between the first and the second mold units and an opened position in which the second mold unit is spaced apart from the first mold unit, the second mold unit is coupled to a heat source to cause the second mold unit to be at a molding temperature,   wherein the second mold unit is formed to include a passageway in fluid connection with a source of pressurized gas and an array of holes formed in the second mold unit that are arranged to open into the passageway to cause pressurized gas to be communicated from the passageway to the mold cavity when the second mold unit is in the closed position, the pressurized gas flows through the passageway absorbing heat from the second mold unit to cause a hot pressurized gas to be established prior to the hot pressurized gas entering the mold cavity.   
     
     
         2 . The mold system of  claim 1 , wherein the hot pressurized gas has a hot-gas temperature about equal to the molding temperature. 
     
     
         3 . The mold system of  claim 1 , wherein the passage includes a perimeter portion and a distribution portion, the perimeter portion is arranged to extend around a perimeter of the second mold unit to cause heat to be transferred from the second mold unit to the pressurized gas to the hot pressurized gas, and the distribution portion is in fluid communication with the perimeter portion and in fluid communication with the array of holes to cause the hot pressurized gas to be delivered to the mold cavity. 
     
     
         4 . The mold system of  claim 1 , wherein the passageway is configured to cause the hot-gas temperature of the hot pressurized gas to be provided prior to the hot pressurized gas moving through the array of holes. 
     
     
         5 . The mold system of  claim 1 , wherein the pressurized gas has a cold-gas temperature and the cold-gas temperature is about equal to room temperature. 
     
     
         6 . The mold system of  claim 1 , wherein the first mold unit is coupled to a heat source to cause the first mold unit to be at the molding temperature and wherein the first mold unit is formed to include a passageway in fluid connection with the source of pressurized gas and an array of holes is formed in the first mold unit that are arranged to open into the passageway to cause pressurized gas to be communicated from the passageway to the mold cavity when the second mold unit is in the closed position to cause heat to be transferred from the first mold unit to the pressurized gas to cause the hot pressurized gas to be established prior to the hot pressurized gas entering the mold cavity. 
     
     
         7 . The mold system of  claim 1 , wherein the hot pressurized gas is vented through a perimeter of the mold system after the hot pressurized gas has moved through the mold cavity. 
     
     
         8 . The mold system of  claim 1 , wherein each hole in the array of holes of the first mold unit is aligned with an associated hole in the array of holes in the second mold unit to cause the array of holes in the first mold unit to be a mirror of the array of holes in the second mold unit. 
     
     
         9 . The mold system of  claim 1 , wherein the array of holes of the first mold unit is offset from the array of holes of the second mold unit to cause convective heat transfer from the hot pressurized gas to be maximized. 
     
     
         10 . The mold system of  claim 1 , wherein the first mold unit is formed to include a vent passageway in fluid connection with atmosphere surrounding the mold system and an array of vent holes formed in the first mold unit that are arranged to open into the vent passageway to cause the hot pressurized gas to be communicated from mold cavity to the vent passageway after the hot pressurized gas moves through the mold cavity. 
     
     
         11 . The mold system of  claim 1 , wherein the pressurized gas is air. 
     
     
         12 . The mold system of  claim 1 , wherein the pressurized gas is steam. 
     
     
         13 . The mold system of  claim 12 , wherein the steam is superheated. 
     
     
         14 . The molding system of  claim 1 , wherein the hot pressurized gas has a pressure and flow rate configured to minimize dimpling and deformation of an uncured blank in the mold cavity. 
     
     
         15 . A molding process comprising the step of
 inserting an uncured blank in a mold cavity formed in a mold system, the uncured blank including fiber and uncured binder,   transferring heat from the mold system to a cool pressurized gas to establish a hot pressurized gas,   injecting the hot pressurized gas into the mold cavity, and   transferring heat from the hot pressurized gas to the uncured blank to cause the uncured binder to cure and establish a cured product.   
     
     
         16 . The molding process of  claim 15 , further comprising the steps of transferring heat from the mold system to the uncured blank to cause uncured binder to cure. 
     
     
         17 . The molding process of  claim 15 , wherein the uncured binder is substantially free of formaldehyde. 
     
     
         18 . The molding process of  claim 15 , wherein the hot pressurized gas has a hot-gas temperature of about 100 degrees Fahrenheit to about 300 degrees Fahrenheit. 
     
     
         19 . The molding process of  claim 15 , wherein the hot pressurized gas has a hot-gas temperature of about 200 degrees Fahrenheit to about 500 degrees Fahrenheit. 
     
     
         20 . The molding process of  claim 15 , wherein in the pressurized gas has a pressure and flow rate configured to minimize dimpling and deformation of an uncured blank in the mold cavity.