Dicing Device and Dicing Method

Abstract

To stably perform cutting process even on a workpiece formed from a brittle material, in a ductile mode with high precision, without causing cracking and/or breaking in the workpiece. A dicing device which performs cutting process on a workpiece includes: a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80% or more of the diamond abrasive grains; a spindle (rotating mechanism) configured to rotate the dicing blade; and a movement mechanism configured to move the workpiece relatively to the dicing blade while forming a constant cut depth on the workpiece by the dicing blade.

What is claimed is: 
     
         1 . A dicing device which performs cutting process on a workpiece, comprising:
 a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains  80  vol % or more of the diamond abrasive grains;   a rotating mechanism configured to rotate the dicing blade; and   a movement mechanism configured to move the workpiece relatively to the dicing blade while the dicing blade forms a constant cut depth on the workpiece.   
     
     
         2 . The dicing device according to  claim 1 , wherein the dicing blade forms a cut on the workpiece while rotating in a down-cutting direction. 
     
     
         3 . The dicing device according to  claim 1 , wherein recessed parts which are formed on a surface of the diamond sintered body are continuously provided on an outer circumferential part of the dicing blade along a circumferential direction. 
     
     
         4 . The dicing device according to  claim 1 , wherein the diamond sintered body is formed by sintering the diamond abrasive grains with use of a sintering aid of a soft metal. 
     
     
         5 . The dicing device according to  claim 1 , wherein an average particle size of the diamond abrasive grains is 25 μm or less. 
     
     
         6 . The dicing device according to  claim 1 , wherein an outer circumferential part of the dicing blade is formed so as to be thinner than an inside portion of the outer circumferential part. 
     
     
         7 . The dicing device according to  claim 6 , wherein a thickness of the outer circumferential part of the dicing blade is 50 μm or less. 
     
     
         8 . The dicing device according to  claim 6 , wherein
 the rotating mechanism includes a flange surface which is made from a metal and is vertical to a rotation axis around which the dicing blade is rotated, and   the dicing blade includes a reference plane portion on one side surface, and is fixed to the rotation axis in a state in which the reference plane portion is made to abut on the flange surface.   
     
     
         9 . The dicing device according to  claim 8 , wherein the reference plane portion of the dicing blade is formed into an annular shape around the rotation axis. 
     
     
         10 . A dicing device which performs cutting process on a workpiece, comprising:
 a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains  80  vol % or more of the diamond abrasive grains;   a rotating mechanism configured to rotate the dicing blade; and   a movement mechanism configured to move the workpiece relatively to the dicing blade while forming a constant cut depth on the workpiece by the dicing blade and supplying fine particles to the dicing blade.   
     
     
         11 . A dicing method which performs cutting process on a workpiece, comprising the steps of:
 forming a constant cut depth on the workpiece while rotating a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and that contains  80  vol % or more of the diamond abrasive grains; and   moving the workpiece relatively to the dicing blade in a state in which the constant cut depth is formed on the workpiece by the dicing blade.   
     
     
         12 . The dicing method according to  claim 11 , wherein the dicing blade forms a cut on the workpiece while rotating in a down-cutting direction. 
     
     
         13 . The dicing method according to  claim 11 , wherein recessed parts which are formed on the surface of the diamond sintered body are continuously provided on an outer circumferential part of the dicing blade along a circumferential direction. 
     
     
         14 . The dicing method according to  claim 11 , wherein the diamond sintered body is formed by sintering the diamond abrasive grains with use of a sintering aid of a soft metal. 
     
     
         15 . The dicing method according to  claim 11 , wherein an average particle size of the diamond abrasive grains is 25 μm or less. 
     
     
         16 . The dicing method according to  claim 11 , wherein an outer circumferential part of the dicing blade is formed so as to be thinner than an inside portion of the outer circumferential part. 
     
     
         17 . The dicing method according to  claim 15 , wherein
 there is provided a flange surface which is made from a metal and is vertical to a rotation axis around which the dicing blade is rotated, and   the dicing blade includes a reference plane portion on one side surface, and is fixed to the rotation axis in a state in which the reference plane portion is made to abut on the flange surface.   
     
     
         18 . The dicing method according to  claim 17 , wherein the reference plane portion of the dicing blade is formed into an annular shape around the rotation axis. 
     
     
         19 . The dicing method according to  claim 15 , wherein a thickness of the outer circumferential part of the dicing blade is 50 μm or less.