Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime

Abstract

Embodiments of the present invention generally relate to a blade for isolating devices within a wafer and the method of isolating. The blade has a core material, a cutting material disposed on the core material, and a plating material covering a portion of the core and cutting materials. The edge of the blade is not covered by the plating material. During operation, a portion of the plating material is removed to expose the underlying core and cutting materials based on the wearing of the core and cutting materials at the edge of the blade.

What is claimed is: 
     
         1 . A blade for isolating devices, comprising:
 a core material including a center and a first diameter;   a cutting material disposed on the core material; and   a plating material disposed on a portion of the core material and the cutting material, wherein the plating material shares a same center with the core material and has a second diameter that is less than the first diameter.   
     
     
         2 . The blade of  claim 1 , wherein the core material is formed of a metal. 
     
     
         3 . The blade of  claim 2 , wherein the cutting material is formed of diamond particles. 
     
     
         4 . The blade of  claim 3 , wherein the plating material is formed of a same material as the core material. 
     
     
         5 . The blade of  claim 1 , wherein a difference between the first diameter and the second diameter is about 1.25 mm. 
     
     
         6 . The blade of  claim 5 , wherein the core material has a thickness of about 70 μm. 
     
     
         7 . The blade of  claim 6 , wherein the plating material has a thickness of about 200 μm. 
     
     
         8 . The blade of  claim 5 , wherein the core material has a thickness of about 50 μm. 
     
     
         9 . A blade assembly for isolating devices, comprising:
 a spindle hub; and   a blade coupled to the spindle hub, wherein the blade including:
 a core material having a center and a first diameter; 
 a cutting material disposed on the core material; and 
 a plating material disposed on a portion of the core material and the cutting material, wherein the plating material shares a same center and a second diameter that is less than the first diameter. 
   
     
     
         10 . The blade assembly of  claim 9 , wherein the core material is formed of a metal. 
     
     
         11 . The blade assembly of  claim 10 , wherein the cutting material is formed of diamond particles. 
     
     
         12 . The blade assembly of  claim 11 , wherein the plating material is formed of nickel. 
     
     
         13 . The blade assembly of  claim 9 , wherein a difference between the first diameter and the second diameter is about 1.25 mm. 
     
     
         14 . The blade assembly of  claim 13 , wherein the core material has a thickness of about 70 μm. 
     
     
         15 . The blade assembly of  claim 14 , wherein the plating material has a thickness of about 200 μm. 
     
     
         16 . The blade assembly of  claim 13 , wherein the core material has a thickness of about 50 μm. 
     
     
         17 . A method for making a blade, comprising:
 depositing a cutting material on two sides of a core material;   depositing a plating material on the two sides of the core material, wherein the plating material covers the core and the cutting materials; and   removing a portion of the plating material to expose underlying cutting and core materials.   
     
     
         18 . The method of  claim 17 , wherein the plating material is formed of a same material as the core material. 
     
     
         19 . The method of  claim 18 , wherein the removal of the portion of the plating material is performed with a dressing stick. 
     
     
         20 . The method of  claim 19 , wherein the dressing stick is formed of aluminum oxide.