US2015107366A1PendingUtilityA1

Electroactive Polymer Based Pressure Sensor

43
Assignee: PARKER HANNIFIN CORPPriority: Dec 29, 2011Filed: Nov 7, 2014Published: Apr 23, 2015
Est. expiryDec 29, 2031(~5.5 yrs left)· nominal 20-yr term from priority
G01L 9/12H02N 1/08G01L 19/142G01L 19/04G01L 19/0023G01L 7/00Y10T137/8158G01L 19/0084G01L 19/0007G01L 19/0645G01L 19/148G01L 9/0072G01L 9/008H10N 30/2046H10N 30/302
43
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Claims

Abstract

A sensor including a buffer material layer configured to at least partially deflect when a force or pressure is imparted on the buffer material layer; and an electroactive polymer (EAP) cartridge in operative contact with the buffer material layer, wherein the EAP cartridge is configured to generate an output signal that corresponds to an amount of strain imparted on the EAP cartridge. The EAP cartridge may be used in a variety of sensing applications including as a pressure sensor integrated into a fluid connector. One aspect of the invention provides for selection of a buffer material layer based upon a desired pressure range.

Claims

exact text as granted — not AI-modified
1 - 27 . (canceled) 
     
     
         28 . A sensor comprising:
 a dielectric layer having a first array of electrodes on a first surface and a second array of electrodes on an opposing second surface, wherein the first array of electrodes and the second array of electrodes are at least partially aligned about an axis;   a first planar member having a first void formed between opposing surfaces of the first planar member and a first conductive trace formed around the void on a first side of the first planar member, and a second conductive trace formed on the first side of the planar member, wherein the first conductive trace is configured to contact one of the first array of electrodes on the dielectric layer and the second conductive trace is configured to contact another one of the first array of electrodes;   a second planar member having a second void formed between opposing surfaces of the second planar member and a third conductive trace formed around the second void on a first side of the second planar member and a fourth conductive trace formed on the first side of the second planar member, wherein the third conductive trace is configured to contact one of the first array of electrodes on the dielectric layer and the fourth conductive trace is configured to contact another one of the first array of electrodes;   a first adhesive layer configured to secure the first planar member to the dielectric layer; and   a second adhesive layer configured to secure the second planar member to the dielectric layer.   
     
     
         29 . The sensor of  claim 28 , wherein first array of electrodes and the second array of electrodes are operatively coupled to a power supply to produce the output signal. 
     
     
         30 . The sensor of  claim 28  further including a connector coupled to the output signal, wherein the connector facilitates input to the sensor and/or output of the output signal. 
     
     
         31 . The sensor of  claim 28  further including a wireless adapter operatively coupled to the sensor, wherein the wireless adapter is configured to wirelessly output the out signal. 
     
     
         32 . A sensor comprising:
 a first electroactive polymer (EAP) assembly;   a second EAP assembly;   an insulative layer coupled between the first EAP assembly and the second EAP assembly,   wherein the first EAP assembly and the second EAP assembly are each configured to generate an output signal that corresponds to an amount of strain imparted on each of the respective assemblies.   
     
     
         33 . The sensor of  claim 32 , wherein first EAP assembly and the second EAP assembly include respective active regions, substantially aligned one over another when forming the sensor. 
     
     
         34 . The sensor of  claim 33  further including a first buffer material layer operably coupled to the first EAP assembly, wherein the first buffer material layer is configured to at least partially deflect when force or pressure is imparted on the first buffer material layer. 
     
     
         35 . The sensor of  claim 34  further including a second buffer material layer operably coupled to the second EAP assembly, wherein the second buffer material layer is configured to at least partially deflect when force or pressure is imparted on the second buffer material layer. 
     
     
         36 . The sensor of  claim 35 , wherein the first EAP assembly, the second EAP assembly, the insulative layer and the first buffer material layer and the second buffer material layer are disposed within a body having a primary fluid passageway defined between an inlet port and an outlet port, wherein at least one of the first buffer material layer and the second buffer material layer are configured to at least partially deflect when force or pressure is imparted on the buffer material layer by fluid entering the primary fluid passageway. 
     
     
         37 . The sensor of  claim 34  wherein the first buffer material layer provides a pressure seal which allows the EAP assembly to be used in a fluidic application. 
     
     
         38 . The sensor of  claim 34  wherein the first buffer material layer provides physical features to maintain alignment of the first buffer material layer within the assembly.

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