Fabricating method of touch cover

Abstract

A fabricating method of a touch cover is provided. The method includes shaping a substrate so that the substrate has an inner plane and an inner side surface extending from the inner plane, wherein the inner plane and the inner side surface are not coplanar. A conductor layer is formed all over the inner plane and the inner side surface of the substrate. The conductor layer is patterned to form a sensing circuit on the inner plane and to form at least a portion of a grounding circuit on the inner side surface.

What is claimed is: 
     
         1 . A fabricating method of a touch cover, comprising
 shaping a substrate so that the substrate has an inner plane and an inner side surface extending from the inner plane, wherein the inner plane and the inner side surface are not coplanar;   forming a conductor layer all over the inner plane and the inner side surface of the substrate; and   patterning the conductor layer to form a sensing circuit on the inner plane and to form a grounding circuit completely on the inner side surface.   
     
     
         2 . The fabricating method of a touch cover as claimed in  claim 1 , further comprising cutting a plurality of the substrates from a mother substrate before shaping the substrate. 
     
     
         3 . The fabricating method of a touch cover as claimed in  claim 1 , further comprising performing a chemical strengthening process on the shaped substrate after shaping the substrate and before forming the conductor layer. 
     
     
         4 . The fabricating method of a touch cover as claimed in  claim 1 , wherein the step of patterning the conductor layer is patterning the conductor layer by a laser. 
     
     
         5 . The fabricating method of a touch cover as claimed in  claim 4 , wherein a beam diameter of the laser is 30 μm. 
     
     
         6 . The fabricating method of a touch cover as claimed in  claim 1 , further comprising disposing a light-shielding layer on the inner plane and the inner side surface after patterning the conductor layer, the light-shielding layer covering the grounding circuit.