Ruggedized computer and aspects thereof

Abstract

A ruggedized computer, having a thermally conductive metal case having an interior surface and a thermal mass made of thermally conductive metal, suspended from the interior surface of the metal case. Also, a slide plate is supported within the metal case and is in thermal contact to the thermal mass; and a delicate, heat-producing integrated circuit, having a planar surface, is supported in the computer, with the planar surface being in thermal contact to the slide plate. Finally, the slide plate is held in place by a resilient system that permits, but gently resists, movement perpendicular to the integrated circuit, which is thereby not damaged due to force applied from the thermal mass through the slide plate to the integrated circuit, but whereby the thermal mass enhances thermal stability of the integrated circuit.

1 . A ruggedized computer, comprising:
 (a) a thermally conductive metal case having an interior surface and a thermal mass made of thermally conductive metal, suspended from said interior surface of said metal case;   (b) a slide plate, supported within said metal case and in thermal contact to said thermal mass;   (c) a delicate, heat-producing integrated circuit, having a planar surface, and supported in said computer, said planar surface being in thermal contact to said slide plate; and   (d) wherein said slide plate is held in place by a resilient system that permits, but gently resists, movement perpendicular to said integrated circuit, which is thereby not damaged due to force applied from said thermal mass through said slide plate to said integrated circuit, but whereby said thermal mass enhances thermal stability of said integrated circuit.   
     
     
         2 . The computer of  claim 1 , wherein said case is fluid-tight. 
     
     
         3 . The computer of  claim 1 , wherein thermally conductive grease is interposed between said delicate, heat-producing structure and said slide plate to facilitate transmission of heat while permitting separation between said delicate, heat-producing structure and said slide-plate. 
     
     
         4 . The computer of  claim 1 , wherein thermally conductive grease is interposed between said slide plate and said thermal mass, to facilitate transmission of heat, while permitting separation between said slide plate and said thermal mass. 
     
     
         5 . The computer of  claim 1 , wherein said integrated circuit is a central processing unit of said computer. 
     
     
         6 . The computer of  claim 5 , wherein said computer has a single central processing unit, only. 
     
     
         7 . The computer of  claim 1 , wherein said thermal mass is made of an aluminum alloy. 
     
     
         8 . The computer of  claim 7 , wherein said aluminum alloy is 2024 aluminum alloy. 
     
     
         9 . The computer of  claim 1 , wherein said thermal mass has a mass of about 100 grams. 
     
     
         10 . The computer of  claim 1 , wherein said thermal mass is suspended from said interior surface of said case at a single point, thereby permitting changes in relative orientation, between said thermal mass and said case. 
     
     
         11 . The computer of  claim 1 , wherein said thermal mass is suspended from an interior side surface of said interior surface of said case. 
     
     
         12 . The computer of  claim 1 , further including a hard disk drive. 
     
     
         13 . The computer of  claim 12 , further including an additional disk drive, so that there are two disk drives in all. 
     
     
         14 . The computer of  claim 1 , further including a printed circuit board, supporting said integrated circuit. 
     
     
         15 . The computer of  claim 14 , wherein said printed circuit board is connected to said integrated circuit by way of solder balls.