Plate type cooling apparatus

Abstract

A plate type cooling apparatus is disclosed. The plate type cooling apparatus in accordance with an embodiment of the present invention includes: a first elastic plate made of an elastic material; a second elastic plate made of an elastic material and having one end thereof joined with the first elastic plate and the other end thereof separated from the first elastic plate; a piezoelectric element coupled with at least one of the first elastic plate and the second elastic plate and being deformable by applied electric power; and a power source coupled with the piezoelectric element so as to apply electric power to the piezoelectric element.

1 . A plate type cooling apparatus, comprising:
 a first elastic plate made of an elastic material;   a second elastic plate made of an elastic material and having one end thereof joined with the first elastic plate and the other end thereof separated from the first elastic plate;   a piezoelectric element coupled with at least one of the first elastic plate and the second elastic plate and being deformable by applied electric power; and   a power source coupled with the piezoelectric element so as to apply electric power to the piezoelectric element.   
     
     
         2 . The plate type cooling apparatus of  claim 1 , wherein each of the first elastic plate and the second elastic plate comprises:
 a joined portion in which opposite faces are tightly contacted and joined with each other; and   a vibrating portion which is bent in the shape of branching from the joined portion and to which the piezoelectric element is coupled.   
     
     
         3 . The plate type cooling apparatus of  claim 2 , wherein the piezoelectric element is coupled to the vibrating portion by being extended lengthwise from a bent point to an end of the vibrating portion. 
     
     
         4 . The plate type cooling apparatus of  claim 2 , further comprising:
 a base having a heat source installed thereon; and   a protrusion protruded above the base by a predetermined height to have the joined portion connected thereto.   
     
     
         5 . The plate type cooling apparatus of  claim 4 , wherein the protrusion has a plurality of coupling protrusions formed on an upper surface thereof,
 wherein the joined portion has coupling holes, which correspond to the coupling protrusions, formed therein, and   wherein the coupling protrusions are inserted in the coupling holes when the joined portion and the protrusion are coupled with each other.   
     
     
         6 . The plate type cooling apparatus of  claim 4 , further comprising a buffer interposed between the joined portion and the protrusion so as to absorb a shock. 
     
     
         7 . The plate type cooling apparatus of  claim 2 , wherein a width of the joined portion is smaller than a width of the vibrating portion.