Component reachable expandable heat plate

Abstract

Some embodiments of the invention provide a heat plate system that includes a closed vessel having at least one flexible surface. The flexible surface allows the vessel to come into intimate contact with heat-generating components (e.g., integrated circuits) residing at varying heights above the floor of a module (e.g., an avionics module). In some embodiments, the material may allow the heat plate to expand in response to absorbing heat, so that it may mold itself around the contours of different heat-generating components, increasing the surface area contact between the heat plate and the components, and increasing the heat plate's ability to conduct heat away from the components.

What is claimed is: 
     
         1 . An apparatus for use with a module comprising components which generate heat during operation, each of the components having a component surface, the apparatus comprising:
 a closed vessel adapted for installation within the module to conduct heat away from the components, the closed vessel storing a fluid in a liquid state and a gaseous state, the vessel comprising at least one vessel surface adapted to contact the component surface of each component, the at least one vessel surface being at least partially formed of a material exhibiting a Young's modulus of at least 120 MPa and a tensile strength of at least 231 MPa at room temperature.   
     
     
         2 . The apparatus of  claim 1 , wherein the material exhibits a Young's modulus of approximately 2.5 GPa at room temperature. 
     
     
         3 . The apparatus of  claim 2 , wherein the material is a polyimide film. 
     
     
         4 . The apparatus of  claim 1 , wherein the material is non-conductive or dielectric. 
     
     
         5 . The apparatus of  claim 1 , wherein the material exhibits a tensile strength of approximately 330 MPa at room temperature. 
     
     
         6 . The apparatus of  claim 5 , wherein the material comprises at least one of an aluminum foil and a gold foil. 
     
     
         7 . The apparatus of  claim 1 , wherein the component surface of each of the components resides at a different height above a floor of the module, and wherein the vessel surface comes into contact with substantially the entirety of each component surface when installed in the module. 
     
     
         8 . The apparatus of  claim 1 , wherein the material accommodates expansion of the fluid in response to absorbing heat generated by the plurality of components. 
     
     
         9 . The apparatus of  claim 1 , wherein the module comprises side walls extending orthogonally from a floor of the module, and wherein the closed vessel is adapted to conduct heat generated by the components to at least one of the side walls. 
     
     
         10 . The apparatus of  claim 1 , wherein the fluid comprises one or more of water, alcohol and paraffin. 
     
     
         11 . The apparatus of  claim 1 , in combination with the module. 
     
     
         12 . The apparatus of  claim 1 , wherein the module is an avionics module. 
     
     
         13 . The apparatus of  claim 1 , wherein the plurality of components comprise at least one integrated circuit. 
     
     
         14 . A method for use in a system comprising a module having components which generate heat during operation, each of the components having a component surface, the method comprising an act of:
 (A) employing a closed vessel to conduct heat away from the components, the vessel being adapted for installation within the module and storing a fluid in a liquid state and a gaseous state, the vessel comprising at least one vessel surface adapted to contact the component surface of each component, the at least one vessel surface being at least partially formed of a material exhibiting a Young's modulus of at least 120 MPa and a tensile strength of at least 231 MPa at room temperature.   
     
     
         15 . The method of  claim 14 , wherein the material exhibits a Young's modulus of approximately 2.5 GPa at room temperature. 
     
     
         16 . The method of  claim 15 , wherein the material is a polyimide film. 
     
     
         17 . The method of  claim 14 , wherein the material is non-conductive or dielectric. 
     
     
         18 . The method of  claim 14 , wherein the component surface of each of the components resides at a different height above a floor of the module, and wherein the act (A) comprises causing the vessel surface to come into contact with substantially the entirety of each component surface. 
     
     
         19 . The method of  claim 14 , wherein the module comprises side walls extending orthogonally from a floor of the module, and wherein the act (A) comprises conducting heat generated by the components to at least one of the side walls. 
     
     
         20 . The method of  claim 14 , wherein the plurality of components comprise at least one integrated circuit.