Uniform emission led package

Abstract

An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

We claim: 
     
         1 . An emitter package, comprising:
 a submount;   a solid state emitter mounted to a surface of said submount; and   an encapsulant over said surface of said submount and over said solid state emitter, the size and shape of said encapsulant at least partially defined by the size and shape of said submount, wherein at least a portion of said encapsulant extends to an edge of said surface such that said portion of said encapsulant has an edge which is parallel to the edge of said surface.   
     
     
         2 . The package of  claim 1 , wherein said encapsulant comprising a curved surface over said solid state emitter. 
     
     
         3 . The package of  claim 1 , wherein said solid state emitter comprises a light emitting diode. 
     
     
         4 . The package of  claim 1 , wherein the edge of said surface comprises a physical feature from the group an edge, corner, ledge and trench. 
     
     
         5 . The package of  claim 1 , wherein said submount has a circular, square, rectangular or octagonal shape around said emitter. 
     
     
         6 . The package of  claim 1 , wherein said submount is mounted to a printed circuit board. 
     
     
         7 . The package of  claim 1 , comprising a secondary encapsulant covering said encapsulant and said submount. 
     
     
         8 . The package of  claim 7 , wherein said encapsulant comprises a conversion material, and wherein said secondary encapsulant is transparent to the wavelength of light emitted by said emitter and said conversion material, and wherein said secondary encapsulant has a higher index of refraction than said encapsulant. 
     
     
         9 . A method for manufacturing an emitter package, comprising:
 providing a body with a surface having a first meniscus holding feature;   introducing a liquid encapsulant matrix over said emitter and said surface, said first meniscus holding feature holding said liquid matrix encapsulant in a dome-shape over said emitter; and   curing said matrix encapsulant.   
     
     
         10 . The method of  claim 9 , wherein said body comprises a solid state emitter. 
     
     
         11 . The method of  claim 10 , wherein said first meniscus holding feature comprises the top edge of said solid state emitter. 
     
     
         12 . The method of  claim 9 , wherein said body comprises a submount, said method comprising the further step of mounting a solid state emitter to said submount with said meniscus holding feature around said emitter. 
     
     
         13 . The method of  claim 9 , wherein the viscosity of said liquid matrix encapsulant and the width of said first meniscus holding feature around said solid state emitter provides a meniscus at said meniscus holding feature holding said liquid matrix encapsulant in said dome-shape. 
     
     
         14 . The method of  claim 10 , further comprising a second meniscus holding feature around said first meniscus holding feature, and further comprising introducing an intermediate/secondary encapsulation material over said cured matrix encapsulant, the second meniscus holding feature influencing the width and shape of said intermediate/secondary encapsulant. 
     
     
         15 . The method of  claim 12 , further comprising curing said intermediate/secondary encapsulant. 
     
     
         16 . The method of  claim 10 , further comprising mounting said submount to a printed circuit board (PCB). 
     
     
         17 . An emitter package, comprising:
 a solid state emitter having a first meniscus forming feature;   an encapsulant on a surface of said solid state emitter and at least partially covering said surface, said first meniscus forming feature forming said encapsulant in a substantially dome-shape on said surface at least partially by the meniscus formed between said first meniscus forming feature and said encapsulant.   
     
     
         18 . The emitter package of  claim 17 , wherein said first meniscus holding feature comprises an edge of said solid state emitter. 
     
     
         19 . The emitter package of  claim 17 , wherein said first meniscus forming feature comprises a physical transition. 
     
     
         20 . The emitter package of  claim 17 , further comprising a second meniscus holding feature. 
     
     
         21 . An emitter package, comprising:
 a submount;   a solid state emitter mounted to said submount, said submount comprising a non-circular meniscus forming feature, integral to said submount, around said solid state emitter; and   an encapsulant matrix on said submount and covering said solid state emitter, the size and shape of said encapsulant matrix at least partially defined by the dimensions and shape of said non-circular meniscus forming feature;   a second encapsulant on said surface of said submount and covering said encapsulant matrix wherein at least a surface of said second encapsulant conforms to the shape of said encapsulant matrix; and   one or more additional meniscus forming features around said non-circular meniscus forming feature;   wherein said encapsulant matrix is generally dome-shaped with a base defined by said non-circular meniscus forming feature.   
     
     
         22 . The emitter package of  claim 21 , wherein said meniscus forming feature is rectangular. 
     
     
         23 . The emitter package of  claim 21 , wherein said meniscus forming feature is octagonal. 
     
     
         24 . The emitter package of  claim 21 , wherein said meniscus forming feature is polygonal.