Heat Dissipation with an On-Board Connector

Abstract

Electronic or opto-electronic on-board connector and method to dissipate heat from such a connector. The connector is positioned within the scope of a cooling air flow. The component includes a heat sink with a heat sink base carrying a plurality of upwardly extending elements, such as pins or fins. The heat sink base makes an angle with the flow direction of the cooling air flow.

1 . Method to dissipate heat from an electronic or optoelectronic component positioned within the scope of a cooling air flow, wherein the electronic or optoelectronic component comprises a heat sink with a heat sink base carrying a plurality of upwardly extending elements, wherein the heat sink base makes an angle with the flow direction of the cooling air flow. 
     
     
         2 . Method according to  claim 1  wherein the upwardly extending elements of the heat sink include pins and/or fins. 
     
     
         3 . Method according to  claim 2  wherein the pins and/or fins are under right angles with the heat sink base. 
     
     
         4 . Method according to  claim 1  wherein the angle between the air flow direction and the heat sink base in side view is 0<α≦45 degrees, e.g., 0<α≦30 degrees. 
     
     
         5 . Method according to  claim 4  wherein the angle between the air flow direction and the heat sink base in side view is at least 4 degrees. 
     
     
         6 . Assembly comprising at least one board connector on a substrate and a cooling air source generating a flow of cooling air in a flow direction, wherein the board connector has a top surface at least partly covered with a heat sink comprising a heat sink base carrying a plurality of upwardly extending heat dissipation elements, and wherein the air flow is directed under an angle with the top face of the board connector. 
     
     
         7 . Board connector according to  claim 6  wherein in side view the top face makes an angle of 30 degrees or less with the substrate. 
     
     
         8 . Board connector according to  claim 7  wherein in side view the top face makes art angle of at least 4 degrees with the substrate. 
     
     
         9 . Board connector according to  claim 8  comprising an optical transceiver configured to receive a complementary optical cable connector. 
     
     
         10 . Board connector according to  claim 8  comprising at least one thermo-conductive bridge between a heat generating component in the connector and the connector top face.