Wire loop forming systems and methods of using the same

Abstract

A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.

What is claimed: 
     
         1 . A method of forming a wire loop comprising the steps of:
 a) bonding a first portion of a wire from a wire supply to a first bonding location of a substrate using a wire bonding tool carried by a bond head;   b) extending the wire from the first bonding location to an elevated position above the first bonding location;   c) shaping a second portion of the wire proximate the elevated position to form a bend using a wire shaping tool carried by the bond head and moveable with respect to the bond head and the wire bonding tool;   d) extending the wire to a second bonding location of the substrate; and   e) bonding a third portion of the wire to the second bonding location using the wire bonding tool.   
     
     
         2 . The method of  claim 1  wherein the wire shaping tool forms the bend by a series of bend motions relative to the bond head and the wire bonding tool. 
     
     
         3 . The method of  claim 1  wherein the wire shaping tool is programmable to form bends having varying characteristics depending on a series of bend motions of the wire shaping tool. 
     
     
         4 . The method of  claim 1  wherein step c) includes moving the wire shaping tool along a plurality of trajectories, at least one of the trajectories resulting in contact between the wire shaping tool and the second portion of the wire. 
     
     
         5 . The method of  claim 4  wherein at least one of the trajectories includes pivotal motion. 
     
     
         6 . The method of  claim 1  wherein step c) includes applying a predetermined force against the second portion of the wire using the wire shaping tool. 
     
     
         7 . The method of  claim 6  wherein the predetermined force is applied according to a computer program. 
     
     
         8 . The method of  claims 6  wherein at least one wire clamp carried by the bond head is closed when applying the predetermined force against the second portion of the wire. 
     
     
         9 . The method of  claim 1  wherein step c) includes moving the wire shaping tool at a predetermined velocity to initiate contact with the second portion of the wire. 
     
     
         10 . The method of  claim 9  wherein the wire shaping tool is moved at the predetermined velocity according to a computer program. 
     
     
         11 . The method of  claims 9  wherein at least one wire clamp carried by the bond head is closed when the wire shaping tool initiates contact with the second portion of the wire. 
     
     
         12 . The method of  claim 1  wherein step c) includes shaping the second portion of the wire by simultaneous motion of the bond head and the wire shaping tool.