Substrate processing apparatus and substrate processing method

Abstract

It is an object to prevent adhesion of a processing liquid to a non-processing region of a substrate. In order to achieve the object, a substrate processing apparatus includes a substrate rotating mechanism, a discharging portion for discharging a processing liquid to a substrate, a moving portion for moving a discharging portion, and a controller. The discharging portion starts to discharge the processing liquid at a first position and is moved to a second position. The first position is a position of the discharging portion where a section of a passage of the discharging portion is projected onto a first region, and the second position is a position of the discharging portion where the section of the passage is projected onto a second region. The first region is a region on the peripheral edge side of the substrate from the second region.

What is claimed is: 
     
         1 . A substrate processing apparatus for processing a peripheral edge part of a substrate, comprising:
 a substrate rotating mechanism for holding and rotating a substrate;   a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of said substrate which is being rotated by said substrate rotating mechanism;   a moving portion for moving said discharging portion; and   a controller for controlling each of operations of said discharging portion and said moving portion,   said discharging portion including a discharging port for discharging said processing liquid and a passage for supplying said processing liquid to said discharging port in communication with said discharging port,   wherein said controller controls said discharging portion and said moving portion in such a manner that said discharging portion starts to discharge said processing liquid at a first position above said substrate and is moved to a second position which is closer to a rotating axis of said substrate than said first position while discharging said processing liquid, and continuously discharges said processing liquid at said second position,   said first position is a position of said discharging portion where a section of said passage in a discharging port part of said discharging portion is projected onto a first region in a rotating track of said upper surface peripheral edge part in an axial direction of said passage in said discharging port part,   said second position is a position of said discharging portion where said section of said passage is projected onto a second region in said rotating track in said axial direction of said passage; and   said first region is a region on a peripheral edge side of said substrate from said second region.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein a distance from a peripheral edge of said substrate to a center of said first region is equal to or greater than a half of a diameter of said discharging port. 
     
     
         3 . The substrate processing apparatus according to  claim 1 , wherein a distance from a center of said first region to a center of said second region is equal to or greater than a half of a diameter of said discharging port. 
     
     
         4 . The substrate processing apparatus according to  claim 1 , wherein said controller further controls said discharging portion and said moving portion in such a manner that said discharging portion discharging said processing liquid at said second position is moved to a third position which is more distant from a rotating axis of said substrate than said second position while discharging said processing liquid and stops the discharge of said processing liquid at said third position,
 said third position is a position of said discharging portion where said section of said passage is projected onto a third region in said rotating track in said axial direction of said passage, and   said third region is a region on an peripheral edge side of said substrate from said second region.   
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein a distance from a peripheral edge of said substrate to a center of said third region is equal to or greater than a half of a diameter of said discharging port. 
     
     
         6 . The substrate processing apparatus according to  claim 1 , further comprising:
 a cleaning portion for abutting on said upper surface peripheral edge part of said substrate which is being rotated by said substrate rotating mechanism, thereby cleaning said upper surface peripheral edge part.   
     
     
         7 . A substrate processing apparatus for processing a peripheral edge part of a substrate, comprising:
 a substrate rotating mechanism for holding and rotating a substrate;   a discharging portion for discharging a processing liquid to an upper surface peripheral edge part in an upper surface of said substrate which is being rotated by said substrate rotating mechanism; and   a cleaning portion for abutting on said upper surface peripheral edge part of said substrate which is being rotated by said substrate rotating mechanism, thereby cleaning said upper surface peripheral edge part,   said discharging portion discharging said processing liquid toward a main discharging region which is predefined in a semicircular region at a downstream side in a rotating direction of said substrate with respect to said cleaning portion, said semicircular region being a part of a rotating track of said upper surface peripheral edge part.   
     
     
         8 . The substrate processing apparatus according to  claim 7 , wherein a discharging direction in discharge of said processing liquid by said discharging portion is an oblique direction having a component turned toward a downstream side in a rotating direction of said substrate along a tangential line in a proximity part to said main discharging region in a peripheral edge of said substrate as seen in a rotating axis direction of said substrate from above said discharging portion and a component turned from a central side of said substrate toward a peripheral edge side in an orthogonal direction to said tangential line. 
     
     
         9 . The substrate processing apparatus according to  claim 7 , further comprising:
 a gas injecting portion provided above a part between said cleaning portion and a rotating axis of said substrate in said upper surface of said substrate,   said gas injecting portion injecting a gas from above said substrate toward an injecting target region which is predefined on said upper surface of said substrate, thereby generating, on said substrate, a gas flow turned from said injecting target region toward said cleaning portion side.   
     
     
         10 . The substrate processing apparatus according to  claim 9 , wherein said gas injecting portion further comprises:
 an injecting port for injecting said gas to said injecting target region,   said injecting port being a slit-shaped injecting port which is curved along a proximity part to said cleaning portion including an abutting part on said cleaning portion in a peripheral edge of said substrate and takes a long shape in a circumferential direction of said substrate as seen through in a rotating axis direction of said substrate from above said gas injecting portion.   
     
     
         11 . The substrate processing apparatus according to  claim 9 , wherein said gas injecting portion further comprises:
 a plurality of injecting ports for injecting said gas to said injecting target region,   said plurality of injecting ports being arranged apart from each other on a virtual line which is curved along a proximity part to said cleaning portion including an abutting part on said cleaning portion in a peripheral edge of said substrate as seen through in a rotating axis direction of said substrate from above said gas injecting portion.   
     
     
         12 . The substrate processing apparatus according to  claim 9 , wherein said gas injecting portion further comprises:
 an injecting port for injecting said gas to said injecting target region,   said injecting port being a slit-shaped injecting port which is curved along an opposed part to said peripheral edge of said substrate in an outer peripheral surface of said cleaning portion and takes a long shape in a circumferential direction of said cleaning portion as seen through in a rotating axis direction of said substrate from above said gas injecting portion.   
     
     
         13 . The substrate processing apparatus according to  claim 9 , wherein said gas injecting portion further comprises:
 a plurality of injecting ports for injecting said gas to said injecting target region,   said plurality of injecting ports being arranged apart from each other on a virtual line which is curved along an opposed part to said peripheral edge of said substrate in an outer peripheral surface of said cleaning portion as seen through in a rotating axis direction of said substrate from above said gas injecting portion.   
     
     
         14 . A substrate processing method of processing a peripheral edge part of a substrate, comprising:
 a substrate rotating step of holding and rotating a substrate; and   a discharging step of discharging a processing liquid to an upper surface peripheral edge part in an upper surface of said substrate by a discharging portion including a discharging port capable of discharging the processing liquid simultaneously with the substrate rotating step;   said discharging step including:
 a first step of causing said discharging portion to start discharge of said processing liquid toward a first region in a rotating track in said upper surface peripheral edge part at a first position where said discharging portion can discharge said processing liquid toward said first region; 
 a second step of moving said discharging portion discharging said processing liquid toward said first region at said first position to a second position where said processing liquid can be discharged toward a second region in said rotating track while causing said discharging portion to continuously discharge said processing liquid; and 
 a third step of causing said discharging portion to continuously discharge said processing liquid toward said second region at said second position, 
   said first region being a region on a peripheral edge side of said substrate from said second region.   
     
     
         15 . The substrate processing method according to  claim 14 , wherein a distance from a peripheral edge of said substrate to a center of said first region is equal to or greater than a half of a diameter of said discharging port. 
     
     
         16 . The substrate processing method according to  claim 14 , wherein a distance from a center of said first region to a center of said second region is equal to or greater than a half of a diameter of said discharging port. 
     
     
         17 . The substrate processing method according to  claim 14 , wherein said discharging step comprises:
 a fourth step of moving said discharging portion to a third position while causing said discharging portion discharging said processing liquid toward said second region at said second position to continuously discharge said processing liquid subsequently to said third step; and   a fifth step of causing said discharging portion to stop said discharge of said processing liquid at said third position,   said third position being a position where said discharging portion can discharge said processing liquid toward a third region in said rotating track, and   said third region being a region on a peripheral edge side of said substrate from said second region.   
     
     
         18 . The substrate processing method according to  claim 14 , wherein a distance from a peripheral edge of said substrate to a center of said third region is equal to or greater than a half of a diameter of said discharging port. 
     
     
         19 . The substrate processing method according to  claim 14 , further comprising:
 a cleaning step of cleaning said upper surface peripheral edge part by a cleaning portion simultaneously with at least said substrate rotating step in said substrate rotating step and said discharging step,   said cleaning portion being capable of abutting on said upper surface peripheral edge part of said substrate to which said discharging portion discharges said processing liquid, thereby cleaning said upper surface peripheral edge part.