Methods and compositions for increasing ink clay loading in heatset ink formulations while maintaining ink gloss, and ink formulations produced therefrom

Abstract

A surface-modified hydrophobic clay composition for an ink formulation comprises up to 99 wt % clay particles with a particle-size distribution characterized in that at least 10% are smaller than 0.2 microns, at least 25% are smaller than 0.5 microns, and at least 95% are less than 5 microns; and from about 1 wt % to about 10 wt % of one or more organic compounds selected from quaternary ammonium compounds, organic acids, fatty acids, organic silanes, or organic polysilanes. The surface-modified hydro-phobic day composition may be produced by various methods, including a slurry method or a dry-mixing method. Ink clay loadings in heatset ink formulations may be increased to 10-15% without losing ink gloss. Inks may be produced with lower solvent, resin, and/or pigment concentrations, thereby reducing cost.

1 - 84 . (canceled) 
     
     
         85 . A surface-modified hydrophobic clay composition for an ink formulation, said composition comprising:
 (i) up to 99 wt % clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and   (ii) from about 1 wt % to about 5 wt % of one or more quaternary ammonium compounds given by the formula [R 1 R 2 R 3 R 4 N + ][X − ], wherein each of R 1 , R 2 , R 3 , and R 4  are independently selected hydrocarbon groups or chains, and wherein X is a monovalent anion.   
     
     
         86 . (canceled) 
     
     
         87 . The composition of  claim 85 , wherein at least 50% of said clay particles are smaller than 0.2 microns. 
     
     
         88 - 91 . (canceled) 
     
     
         92 . The composition of  claim 85 , wherein said clay particles comprising one or more clays selected from the Kaolin group of minerals comprising kaolinite, dickite, halloysite, nacrite, montmorrilite, or any other polymorph of Al 2 Si 2 O 5 (OH) 4 . 
     
     
         93 . The composition of  claim 92 , wherein said clay particles are kaolin clay particles. 
     
     
         94 . The composition of  claim 85 , wherein at least one of R 1 , R 2 , R 3 , and R 4  is selected from C 10 -C 24  chains. 
     
     
         95 . The composition of  claim 94 , wherein at least two of R 1 , R 2 , R 3 , and R 4  are selected from C 10 -C 24  chains. 
     
     
         96 . The composition of  claim 85 , wherein at least one of R 1 , R 2 , R 3 , and R 4  is selected from C 1 -C 9  chains. 
     
     
         97 . The composition of  claim 96 , wherein at least two of R 1 , R 2 , R 3 , and R 4  are selected from C 1 -C 9  chains. 
     
     
         98 . The composition of  claim 85 , wherein at least one of R 1 , R 2 , R 3 , and R 4  is a methyl group. 
     
     
         99 . The composition of  claim 98 , wherein at least two of R 1 , R 2 , R 3 , and R 4  are methyl groups. 
     
     
         100 . The composition of  claim 85 , wherein two of R 1 , R 2 , R 3 , and R 4  are methyl groups and wherein the other two of R 1 , R 2 , R 3 , and R 4  are selected from C 16 -C 18  chains. 
     
     
         101 . The composition of  claim 85 , wherein X is an organic anion. 
     
     
         102 . The composition of  claim 85 , wherein X is an inorganic anion. 
     
     
         103 . The composition of  claim 102 , wherein X is a halide anion. 
     
     
         104 . (canceled) 
     
     
         105 . A surface-modified hydrophobic clay composition for an ink formulation, said composition comprising:
 (i) up to 99 wt % clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and   (ii) from about 1 wt % to about 10 wt % of one or more organic compounds selected from the group consisting of a quaternary ammonium compound, an organic acid, a fatty acid, an organic silane, an organic polysilane, and combinations thereof.   
     
     
         106 . The composition of  claim 105 , comprising from about 2 wt % to about 8 wt % of said one or more organic compounds. 
     
     
         107 . (canceled) 
     
     
         108 . The composition of  claim 105 , wherein at least 50% of said clay particles are smaller than 0.2 microns. 
     
     
         109 - 112 . (canceled) 
     
     
         113 . The composition of  claim 105 , wherein said clay particles comprising one or more clays selected from the Kaolin group of minerals comprising kaolinite, dickite, halloysite, nacrite, montmorrilite, or any other polymorph of Al 2 Si 2 O 5 (OH) 4 . 
     
     
         114 . The composition of  claim 113 , wherein said clay particles are kaolin clay particles. 
     
     
         115 . A heatset ink formulation comprising:
 (i) a solvent;   (ii) a pigment or dye;   (iii) a resin;   (iv) clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and   (v) from about 1 wt % to about 5 wt % of one or more organic compounds selected from the group consisting of a quaternary ammonium compound, an organic acid, a fatty acid, an organic silane, an organic polysilane, and combinations thereof.   
     
     
         116 . The heatset ink formulation of  claim 115 , wherein said organic compound is a quaternary ammonium compound given by the formula [R 1 R 2 R 3 R 4 N + ][X − ], wherein each of R 1 , R 2 , R 3 , and R 4  are independently selected hydrocarbon groups or chains, and wherein X is a monovalent anion. 
     
     
         117 . The heatset ink formulation of  claim 116 , wherein at least one of R 1 , R 2 , R 3 , and R 4  is selected from C 10 -C 24  chains. 
     
     
         118 . The heatset ink formulation of  claim 115 , wherein said organic compound is an organic acid. 
     
     
         119 . The heatset ink formulation of  claim 118 , wherein said organic compound is a saturated or unsaturated fatty acid having at least four carbon atoms. 
     
     
         120 . The heatset ink formulation of  claim 119 , wherein said fatty acid is stearic acid. 
     
     
         121 . The heatset ink formulation of  claim 115 , wherein said organic compound is an organic silane. 
     
     
         122 . The heatset ink formulation of  claim 121 , wherein said organic compound is an organic polysilane. 
     
     
         123 . The heatset ink formulation of  claim 115 , wherein said resin is present at about 35 wt % or less in said heatset ink formulation. 
     
     
         124 - 125 . (canceled) 
     
     
         126 . The heatset ink formulation of  claim 115 , wherein said clay particles are present at about 5 wt % or more in said heatset ink formulation. 
     
     
         127 - 128 . (canceled) 
     
     
         129 . A UV-curable ink formulation comprising:
 (i) a solvent;   (ii) a pigment or dye;   (iii) a resin;   (iv) clay particles with a particle-size distribution characterized in that at least 40% of said clay particles are smaller than 0.2 microns, at least 70% of said clay particles are smaller than 0.5 microns, and substantially all of said clay particles are less than 5 microns; and   (v) from about 1 wt % to about 5 wt % of one or more organic compounds selected from the group consisting of a quaternary ammonium compound, an organic acid, a fatty acid, an organic silane, an organic polysilane, and combinations thereof.   
     
     
         130 . The UV-curable ink formulation of  claim 129 , wherein said organic compound is a quaternary ammonium compound given by the formula [R 1 R 2 R 3 R 4 N + ][X − ], wherein each of R 1 , R 2 , R 3 , and R 4  are independently selected hydrocarbon groups or chains, and wherein X is a monovalent anion. 
     
     
         131 . The UV-curable ink formulation of  claim 130 , wherein at least one of R 1 , R 2 , R 3 , and R 4  is selected from C 10 -C 24  chains. 
     
     
         132 . The UV-curable ink formulation of  claim 129 , wherein said organic compound is an organic acid. 
     
     
         133 . The UV-curable ink formulation of  claim 132 , wherein said organic acid is a saturated or unsaturated fatty acid having at least four carbon atoms. 
     
     
         134 . The UV-curable ink formulation of  claim 133 , wherein said fatty acid is stearic acid. 
     
     
         135 . The UV-curable ink formulation of  claim 129 , wherein said organic compound is an organic silane. 
     
     
         136 . The UV-curable ink formulation of  claim 135 , wherein said organic compound is an organic polysilane.