Methods of bonding and articles formed thereby

Abstract

A method of bonding a polymer film to a mating part, including: placing a mating part in a nest; contacting the polymer film and the mating part; heating a die including a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both; actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article; and actuating the die away from the polymer film.

What is claimed is: 
     
         1 . An assembly comprising:
 a nest;   a mating part housed in the nest;   a polymer film in contact with the mating part; and   a die comprising a thermally conductive silicone and a backer, wherein the thermally conductive silicone is located on the backer and the thermally conductive silicone is in contact with the polymer film.   
     
     
         2 . The assembly according to  claim 1 , wherein the nest has a surface that conforms to a surface of the mating part. 
     
     
         3 . The assembly according to  claim 1 , wherein the mating part forms a portion of a cell culture apparatus. 
     
     
         4 . The assembly according to  claim 1 , wherein the mating part forms a multiwall plate of a cell culture apparatus. 
     
     
         5 . The assembly according to  claim 1 , wherein the polymer film has a thickness that is not greater than about 0.001 inch. 
     
     
         6 . The assembly according to  claim 1 , wherein the polymer film and the mating part comprise the same class of polymer. 
     
     
         7 . The assembly according to  claim 6 , wherein the same class of polymer comprises polystyrene, polyethylene, polypropylene, polycarbonate, mixtures thereof, or copolymers thereof 
     
     
         8 . The assembly according to  claim 1 , wherein the backer is aluminum, steel, a thermally conductive ceramic, or combinations thereof 
     
     
         9 . The assembly according to  claim 1  further comprising a resistance heater or an induction heater configured to conduct heat through the backer. 
     
     
         10 . An article comprising:
 a mating part comprising a first material;   a polymer film comprising a second material, the film having a first surface and an opposing second surface;   a bond that attaches the first surface of the polymer film to the mating part; and   a bond region comprising the bond and residual silicone on the second surface of the polymer film.   
     
     
         11 . The article according to  claim 10 , wherein the first material and the second material are the same class of polymer. 
     
     
         12 . The article according to  claim 10 , wherein the first material and the second material are chosen from polystyrene, polyethylene, polypropylene, polycarbonate, mixtures thereof, or copolymers thereof 
     
     
         13 . The article according to  claim 10 , wherein the polymer film has a thickness that is not greater than about 0.001 inch. 
     
     
         14 . The article according to  claim 10 , wherein the mating part forms a portion of a cell culture apparatus. 
     
     
         15 . The article according to  claim 10 , wherein the mating part forms a multiwall plate of a cell culture apparatus. 
     
     
         16 . An assembly comprising:
 a nest;   a mating part housed in the nest, wherein the mating part forms a portion of a cell culture apparatus;   a polymer film in contact with the mating part; and   a die comprising a thermally conductive silicone and a thermally conductive backer, wherein the thermally conductive silicone is located on the thermally conductive backer and the thermally conductive silicone is in contact with the polymer film.   
     
     
         17 . The assembly according to  claim 16  further comprising a stripping mechanism. 
     
     
         18 . The assembly according to  claim 16  further comprising a resistance heater or an induction heater configured to conduct heat through the thermally conductive backer. 
     
     
         19 . The assembly according to  claim 16 , wherein the polymer film and the mating part comprise the same class of polymer and the class of polymer comprises polystyrene, polyethylene, polypropylene, polycarbonate, mixtures thereof, or copolymers thereof 
     
     
         20 . The assembly according to  claim 16 , wherein the thermally conductive backer is aluminum, steel, a thermally conductive ceramic, or combinations thereof