Counterbore Pocket Structure for Fluidic Assembly

Abstract

A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.

We claim: 
     
         1 . A fluidic assembly method using a counterbore pocket structure, the method comprising:
 providing a substrate comprising a top surface and a bottom surface, with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface;   flowing an ink comprising a plurality of objects over the substrate top surface;   creating a suction pressure at the substrate bottom surface; and,   in response to the suction pressure from the through-holes, drawing the objects into the counterbore pocket structures.   
     
     
         2 . The method of  claim 1  wherein flowing the ink over the substrate top surface includes flowing an ink comprising a plurality of objects in a shape of a disk. 
     
     
         3 . The method of  claim 2  wherein providing the substrate includes providing counterbore pocket structures having a first diameter sliding fit to accommodate a disk diameter. 
     
     
         4 . The method of  claim 2  wherein providing the substrate includes providing counterbore pocket structures having a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter. 
     
     
         5 . The method of  claim 4  wherein providing the substrate includes providing the through-hole offset from the first diameter center, away from the second portion. 
     
     
         6 . The method of  claim 2  wherein providing the substrate includes providing counterbore pocket structures having a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter. 
     
     
         7 . The method of  claim 1  wherein flowing the ink over the substrate top surface includes:
 arranging the substrate top surface with a substrate first side higher than a substrate second side; 
 introducing the ink to the substrate first side; and, 
 wherein drawing disks into the counterbore pocket structures includes drawings the disks in response to gravity as well as suction pressure. 
 
     
     
         8 . The method of  claim 1  wherein providing the substrate includes providing a transparent substrate; and,
 wherein flowing the ink over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) in the shape of a disk over the substrate top surface. 
 
     
     
         9 . A fluidic assembly substrate comprising:
 a substrate comprising a top surface and a bottom surface;   a plurality of counterbore pocket structures formed in the substrate top surface; and,   a through-hole formed between each counterbore pocket structure and the substrate bottom surface.   
     
     
         10 . The fluidic assembly substrate of  claim 9  wherein the substrate comprises:
 a first layer with through-hole,s formed between a first layer top surface and a first layer bottom surface; and, 
 a second layer with counterbore pocket structure formed between a second layer top surface and a second layer bottom surface. 
 
     
     
         11 . The fluidic assembly substrate of  claim 9  wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter. 
     
     
         12 . The fluidic assembly substrate of  claim 11  wherein the through-hole is offset from the first diameter center, away from the second portion. 
     
     
         13 . The fluidic assembly substrate of  claim 9  wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter. 
     
     
         14 . The fluidic assembly substrate of  claim 9  wherein the substrate is transparent. 
     
     
         15 . A substrate assembly comprising:
 a substrate comprising a top surface and a bottom surface;   a plurality of counterbore pocket structures formed in the substrate top surface;   a through-hole formed between each counterbore pocket structure and the substrate bottom surface; and,   an object at least sliding fit positioned inside each counterbore pocket structure.   
     
     
         16 . The substrate assembly of  claim 15  wherein the objects are disks; and,
 wherein the counterbore pocket structures have a first diameter sliding fit to accommodate a disk diameter. 
 
     
     
         17 . The substrate assembly of  claim 15  wherein the objects are disks; and,
 wherein the counterbore pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter. 
 
     
     
         18 . The substrate assembly of  claim 17  wherein the through-hole is offset from the first diameter center, away from the second portion. 
     
     
         19 . The substrate assembly of  claim 15  wherein the objects are disks; and,
 wherein the counterbore, pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter. 
 
     
     
         20 . The substrate assembly of  claim 15  wherein the substrate is transparent; and,
 wherein the objects are light emitting diodes (LEDs) in the form of disks.