Optical transparent dual cure adhesives composition

Abstract

The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.

1 - 2 . (canceled) 
     
     
         3 . An optical transparent dual cure adhesive composition, based on the total weight of the adhesive composition, the composition comprises:
 40-90 wt % of urethane oligomer having (meth)acryloxy group;   5-55 wt % of (meth)acrylate;   0.5-5 wt % of UV-photoinitiator; and   0.5-5 wt % of thermal initiator.   
     
     
         4 . The composition according to  claim 3 , characterized in that,
 said urethane oligomer having (meth)acryloxy group has an average degree of functionality of more than 0 and equal to or less than 3, preferably from 0.5 to 2.5; and the glass transition temperature T g  thereof is from −80 to 0° C., preferably from −60 to 0° C., and the Brookfield viscosity thereof at the temperature of 25° C. preferably is from 1000 cps to 190000 cps, more preferably from 2000 cps to 150000 cps.   
     
     
         5 . The composition according to  claim 3 , characterized in that, based on the total weight of the adhesive composition, the composition comprises 50-80 wt % of urethane oligomer having (meth)acryloxy group, preferably 60-70 wt %; 10-50 wt % of (meth)acrylate, preferably 20-40 wt %; 1-4 wt % of UV-photoinitiator, preferably 2-3 wt %; 1-4 wt % of thermal initiator, preferably 2-3 wt %. 
     
     
         6 . The composition according to  claim 3 , characterized in that, said urethane oligomer having (meth)acryloxy group has number average molecular weight of 1000-25000 Daltons, preferably 1500-10000 Daltons. 
     
     
         7 . An optical transparent dual cure adhesive composition, based on the total weight of the adhesive composition, the composition comprises:
 10-80 wt % of polyisoprene having (meth)acryloxy group or vinyl group;   10-55 wt % of (meth)acrylate;   0-50 wt % of liquid polybutadiene,   0.5-5 wt % of UV-photoinitiator, and   0.5-5 wt % of thermal initiator.   
     
     
         8 . The composition according to claim characterized in that,
 said polyisoprene having (meth)acryloxy group or vinyl group has an average degree of functionality of 0.5-3, a number average molecular weight of 10000-50000 Daltons, preferably 12000-40000 Daltons, more preferably 15000-35000 Daltons; and   said liquid polybutadiene preferably has a number average molecular weight of 1000-30000 Daltons; more preferably 1500-25000 Daltons, even more preferably 2000-20000 Daltons, particularly preferably 3000-10000 Daltons.   
     
     
         9 . The composition according to  claim 7 , characterized in that,
 based on the total weight of the adhesive composition, the adhesive composition comprises 20-70 wt % of polyisoprene having (meth)acryloxy group or vinyl group, preferably 30-60 wt %; 10-40 wt % of liquid polybutadiene, preferably 20-35 wt %; 20-45 wt % of (meth)acrylate, preferably 25-40 wt %; 1-4 wt % of UV-photoinitiator, preferably 2-3 wt %; and 1-4 wt % of thermal initiator; preferably 2-3 wt %.   
     
     
         10 - 15 . (canceled)