Thermal transfer catalytic heat dissipation structure

Abstract

A thermal transfer catalytic heat dissipation structure is disclosed, which comprises a thermal conductive carrier; a heat source which disposed on a face of the thermal conductive carrier; and a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film, at least disposed on the other face of the thermal conductive carrier. A carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film is used to dissipate a heat source when a thermal conductive carrier absorbs the heat from heat source, so that the heat is effectively transferred to the ambient through the film, avoiding a thermal transfer gap with respect to the ambient (like as air).

1 . A thermal transfer catalytic heat dissipation structure, comprising:
 a thermal conductive carrier,   a heat source, disposed on a face of the thermal conductive carrier; and   a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film, at least disposed on the other face of the thermal conductive carrier.   
     
     
         2 . The thermal transfer catalytic heat dissipation structure as claimed in  claim 1 , wherein the thermal conductive carrier and the heat source are combined with each other through an adhesive. 
     
     
         3 . The thermal transfer catalytic heat dissipation structure as claimed in  claim 1 , wherein the thermal conductive carrier and the heat source are combined with each other through a high heat dissipation insulting layer. 
     
     
         4 . The thermal transfer catalytic heat dissipation structure as claimed in  claim 1 , wherein the thermal conductive carrier comprises a heat dissipation assembly, a fan and a water cooler heat dissipation element. 
     
     
         5 . The thermal transfer catalytic heat dissipation structure as claimed in  claim 1 , wherein a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film is disposed between the heat source and the thermal conductive carrier.