Chemical mechanical polishing conditioner with high quality abrasive particles

Abstract

The present invention relates to a chemical mechanical polishing conditioner with high quality abrasive particles, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles placed on the binding layer, and the abrasive particles are placed on the substrate by the binding layer; wherein the chemical mechanical polishing conditioner with high quality abrasive particles is moved to pass through a water jet and a high pressure fluid by a conveying device, and the high pressure fluid is applied on the abrasive particles through the water jet to remove one or more than one risk diamond included in the abrasive particles. Therefore, the present invention can improve a problem of conventional risk diamond residue on the conditioner, thereby enhancing the polishing performance and service time of the conditioner.

What is claimed is: 
     
         1 . A chemical mechanical polishing conditioner with high quality abrasive particles, comprising:
 a substrate;   a binding layer disposed on a surface of the substrate; and   a plurality of abrasive particles embedded in the binding layer and fixed to the substrate by the binding layer;   wherein the chemical mechanical polishing conditioner with high quality abrasive particles is moved to pass through a water jet and a high pressure fluid by a conveying device, and the high pressure fluid is applied on the abrasive particles through the water jet to remove one or more than one risk diamond included in the abrasive particles.   
     
     
         2 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the risk diamonds have twin crystal structures, internal crack structures or diamonds embedded in the binding layer with low encapsulation. 
     
     
         3 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the water jet comprises one or more than one nozzles. 
     
     
         4 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 3 , wherein the water jet comprises three to five nozzles. 
     
     
         5 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 3 , wherein these nozzles have the same pore sizes of the nozzles. 
     
     
         6 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 3 , wherein these nozzles have different pore sizes of the nozzles. 
     
     
         7 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 3 , wherein different spraying angles are formed by the nozzles. 
     
     
         8 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the water jet is a fixing mechanism, such that the high pressure fluid is applied to fixing positions of these abrasive particles. 
     
     
         9 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the water jet is a rotating mechanism, such that the high pressure fluid is applied to non-fixing positions of these abrasive particles. 
     
     
         10 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 9 , wherein a rotating speed of the rotating mechanism is 10 rpm to 1,050 rpm. 
     
     
         11 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein a pressure of the high pressure applied to these abrasive particles is 1,000 psi to 32,000 psi. 
     
     
         12 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein a moving speed of the conveying device is 10 mm/min to 1,000 mm/min. 
     
     
         13 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the water jet has a cage lifter for adjust a spacing between the water jet and the chemical mechanical polishing conditioner with high quality abrasive particles. 
     
     
         14 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the high pressure fluid is pure water, ultra-pure water and non-corrosive fluid. 
     
     
         15 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the abrasive particles are artificial diamonds, nature diamonds, polycrystalline diamonds or cubic boron nitride. 
     
     
         16 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the abrasive particles have a particle size of 30 to 600 μm. 
     
     
         17 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein a composition of the binding layer is made of a ceramic material, a brazing material, an electroplating material, a metallic material, or a polymer material. 
     
     
         18 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 17 , wherein the brazing material is at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and combinations thereof. 
     
     
         19 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 17 , wherein the polymer material is epoxy resin, polyester resin, polyacrylic resin, phenolic resin. 
     
     
         20 . The chemical mechanical polishing conditioner with high quality abrasive particles of  claim 1 , wherein the substrate is made of stainless steel substrate, mold steel substrate, metal alloy substrate, ceramic material substrate or polymer material substrate or combinations thereof.