Method of making structured hybrid adhesive articles

Abstract

A method is provided for making structured hybrid adhesive articles comprising the steps of: a) providing an adhesive article comprising: i) a base resin comprising an epoxy resin, ii) a first epoxy curative, and iii) a second epoxy curative, by reacting the base resin with the first epoxy curative such that the first epoxy curative is substantially reacted with epoxy resin in the article and the second epoxy curative is substantially unreacted in the article; b) embossing the adhesive article with a relief pattern; and c) curing the adhesive article such that the second epoxy curative is substantially reacted with epoxy in the article. In some embodiments, the method additionally comprises a step of embedding a scrim in the adhesive. In some embodiments, the method additionally comprises a step of depositing an electrically conductive layer onto the surface of the adhesive article embossed with the relief pattern.

1 . A method comprising the steps of:
 a) providing an adhesive article comprising:
 i) a base resin comprising an epoxy resin; 
 ii) a first epoxy curative; and 
 iii) a second epoxy curative; 
   by reacting the base resin with the first epoxy curative such that the first epoxy curative is substantially reacted with epoxy resin in the article and the second epoxy curative is substantially unreacted in the article;   b) embossing the adhesive article with a relief pattern; and   c) curing the adhesive article such that the second epoxy curative is substantially reacted with epoxy in the article.   
     
     
         2 . The method according to  claim 1  wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. 
     
     
         3 . The method according to  claim 1 , wherein the first and second epoxy curatives are chosen such that the second epoxy curative remains substantially unreacted in the composition after 24 hours at 72° F. and the first epoxy curative becomes substantially reacted with epoxy resin in the composition after 24 hours at 72° F. 
     
     
         4 . The method according to  claim 1 , wherein the first epoxy curative is a polymercaptan. 
     
     
         5 . The method according to  claim 1 , wherein the second epoxy curative is a polyamine. 
     
     
         6 . The method according to  claim 1 , wherein the base resin includes no acrylic resin. 
     
     
         7 . The method according to  claim 1  additionally comprising the step of
 d) embedding a scrim in the adhesive layer; 
 
       prior to step b). 
     
     
         8 . The method according to  claim 1  additionally comprising the step of
 d) embedding a scrim in the adhesive layer; 
 
       concurrent with step b). 
     
     
         9 . The method according to  claim 1  additionally comprising the step of
 e) depositing an electrically conductive layer onto at least a portion of the surface of the adhesive article embossed with a relief pattern; 
 
       prior to step c). 
     
     
         10 . The method according to  claim 1  wherein step a) is carried out prior to step b). 
     
     
         11 . The method according to  claim 1  wherein step a) is carried out simultaneously with step b). 
     
     
         12 . The method according to  claim 3 , wherein the first epoxy curative is a polymercaptan. 
     
     
         13 . The method according to  claim 3 , wherein the second epoxy curative is a polyamine. 
     
     
         14 . The method according to  claim 4 , wherein the second epoxy curative is a polyamine. 
     
     
         15 . The method according to  claim 12 , wherein the second epoxy curative is a polyamine. 
     
     
         16 . The method according to  claim 14 , wherein the base resin includes no acrylic resin. 
     
     
         17 . The method according to  claim 15 , wherein the base resin includes no acrylic resin. 
     
     
         18 . The method according to  claim 7  additionally comprising the step of
 e) depositing an electrically conductive layer onto at least a portion of the surface of the adhesive article embossed with a relief pattern; 
 
       prior to step c). 
     
     
         19 . The method according to  claim 8  additionally comprising the step of
 e) depositing an electrically conductive layer onto at least a portion of the surface of the adhesive article embossed with a relief pattern; 
 
       prior to step c). 
     
     
         20 . The method according to  claim 16  additionally comprising the step of
 e) depositing an electrically conductive layer onto at least a portion of the surface of the adhesive article embossed with a relief pattern; 
 
       prior to step c).