Interfacial thermal transfer structure

Abstract

An apparatus that interfaces thermal transfer components is described. The apparatus includes a soft, thermally conductive metal that enables a capillary flow path with a contact surface of a thermal transfer component and an imbibing thermal interface material. The thermal transfer component is a heat sink. The thermally conductive metal includes large pores that intertwine with smaller pores of the contact surface.

What is claimed is: 
     
         1 . An apparatus that interfaces thermal transfer components, the apparatus comprising a soft, thermally conductive metal that enables a capillary flow path with a contact surface of a thermal transfer component comprising a heat sink, and an imbibing thermal interface material, the thermally conductive metal comprising large pores that intertwine with smaller pores of the contact surface. 
     
     
         2 . The apparatus of  claim 1 , comprising expanded metal grids that facilitate the creation of a dual-porosity wick. 
     
     
         3 . The apparatus of  claim 2 , wherein the dual-porosity wick comprises a woven wire mesh. 
     
     
         4 . The apparatus of  claim 1 , being integrated with a base of the heat sink. 
     
     
         5 . The apparatus of  claim 1 , comprising a thickness ranging between 75 μm and 150 μm. 
     
     
         6 . The apparatus of  claim 1 , the large pores comprising interstitial spaces comprising the imbibing thermal interface material. 
     
     
         7 . The apparatus of  claim 1 , the larger pores ranging in diameter from 1 mm-2 mm. 
     
     
         8 . The apparatus of  claim 1 , the smaller pores ranging in diameter from 20 μm-100 μm. 
     
     
         9 . The apparatus of  claim 1 , the capillary flow enabling a flow of excess imbibing thermal interface material from areas of nearest contact between the apparatus and the heat sink, to areas that benefit from additional imbibing thermal interface material. 
     
     
         10 . An apparatus that interfaces thermal transfer components, the apparatus integrated with a base of a heat sink, the apparatus comprising a soft, thermally conductive metal that enables a capillary flow path with a contact surface of a thermal transfer component comprising a heat spreader and an imbibing thermal interface material, the metal thermally conductive metal comprising large pores that intertwine with smaller pores of the contact surface. 
     
     
         11 . The apparatus of  claim 10 , comprising a printed capillary flow path on the contact surface. 
     
     
         12 . The apparatus of  claim 11 , the printed capillary flow path generating expanded metal grids that facilitate the creation of a dual-porosity wick. 
     
     
         13 . The apparatus of  claim 10 , comprising a plurality of thermally conductive mesh. 
     
     
         14 . The apparatus of  claim 11 , comprising a plurality of thermally conductive mesh. 
     
     
         15 . The apparatus of  claim 11 , the plurality of thermally conductive mesh comprising large pores overlaying with respect to large pores of other mesh. 
     
     
         16 . The apparatus of  claim 11 , comprising a plurality of thermally conductive mesh with large pores interspaced with respect to large pores of other mesh. 
     
     
         17 . The apparatus of  claim 10 , large pores comprising interstitial spaces comprising the imbibing thermal interface material. 
     
     
         18 . An apparatus that interfaces a heat sink and a heat spreader, the apparatus comprising a soft, thermally conductive metal that enables a capillary flow path with a contact surface of the heat sink, a contact surface of the heat spreader and an imbibing thermal interface material, when the apparatus is in contact with a portion of a surface of both the heat sink and the heat spreader, the thermally conductive metal comprising large pores that intertwine with smaller pores of the contact surface, the large pores comprising interstitial spaces comprising the imbibing thermal interface material. 
     
     
         19 . The apparatus of  claim 18 , comprising a printed capillary flow path on the contact surface. 
     
     
         20 . The apparatus of  claim 19 , the printed capillary flow path generating expanded metal grids that facilitate the creation of a dual-porosity wick. 
     
     
         21 . The apparatus of  claim 20 , comprising a plurality of thermally conductive mesh. 
     
     
         22 . The apparatus of  claim 21 , the plurality of thermally conductive mesh comprising large pores interspaced with respect to large pores of other mesh.