Light emitter components and methods having improved performance

Abstract

Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (LED) chip disposed over the submount. The submount can contact at least two different sides of the at least one LED chip. In one aspect, a submount can include surface portions adapted to receive portions one or more LED chips. In one aspect, one or more LED chips can be embedded within the submount.

What is claimed is: 
     
         1 . A light emitter component comprising:
 a submount comprising ceramic;   at least one light emitting diode (LED) chip disposed over a first surface of the submount, the submount being adapted to reflect light emitted from at least one LED chip; and   a reflective material disposed on a second surface of the submount opposing the first surface of the submount.   
     
     
         2 . The component according to  claim 1 , wherein at least a portion of the reflective material comprises a reflective layer. 
     
     
         3 . The component according to  claim 1 , wherein at least a portion of the reflective material comprises a coating of reflective material. 
     
     
         4 . The component according to  claim 1 , wherein at least a portion of the reflective material comprises silver. 
     
     
         5 . The component according to  claim 1 , wherein the ceramic comprises alumina. 
     
     
         6 . The component according to  claim 1 , wherein the submount comprises a first layer of material and a second layer of material. 
     
     
         7 . The component according to  claim 6 , wherein the first layer of material comprises a ceramic plate of alumina, and wherein the second layer of material comprises light scattering particles disposed in a matrix material. 
     
     
         8 . The component according to  claim 7 , wherein the light scattering particles comprise one or more particles of Al 2 O 3 , TiO 2 , BaSO 4 , and/or AlN. 
     
     
         9 . The component according to  claim 1 , comprising a plurality of LED chips. 
     
     
         10 . The component according to  claim 1 , wherein the at least one light emitting diode (LED) chip is configured to emit light into the submount. 
     
     
         11 . A light emitter component comprising:
 a submount comprising ceramic;   at least one light emitting diode (LED) chip disposed over the submount, the submount being adapted to reflect light emitted from at least one LED chip; and   a reflective material disposed within at least a portion of the substrate.   
     
     
         12 . The component according to  claim 11 , wherein at least a portion of the reflective material comprises a reflective layer. 
     
     
         13 . The component according to  claim 11 , wherein at least a portion of the reflective material comprises a coating of reflective material. 
     
     
         14 . The component according to  claim 11 , wherein at least a portion of the reflective material comprises silver. 
     
     
         15 . The component according to  claim 11 , wherein the ceramic comprises alumina. 
     
     
         16 . The component according to  claim 11 , wherein the submount comprises a first layer of material and a second layer of material. 
     
     
         17 . The component according to  claim 16 , wherein the first layer of material comprises a ceramic plate of alumina, and wherein the second layer of material comprises light scattering particles disposed in a matrix material. 
     
     
         18 . The component according to  claim 17 , wherein the light scattering particles comprise one or more particles of Al 2 O 3 , TiO 2 , BaSO 4 , and/or AlN. 
     
     
         19 . The component according to  claim 11 , wherein the at least one light emitting diode (LED) chip is configured to emit light into the submount. 
     
     
         20 . The component according to  claim 11 , wherein the reflective material is disposed within at least a portion of a back surface of the submount on an opposing side of the submount from the LED chip.