US2015180129A1PendingUtilityA1

Surface mount antenna contacts

Assignee: HARTENSTEIN ABRAHAMPriority: May 24, 2011Filed: Nov 25, 2014Published: Jun 25, 2015
Est. expiryMay 24, 2031(~4.8 yrs left)· nominal 20-yr term from priority
H05K 3/4015H05K 2203/043H05K 3/366H01Q 9/045H05K 2201/10098H05K 1/14H01R 13/02H01R 12/737Y10T29/49126Y10T29/49018H05K 2201/09172H05K 2201/09181Y02P70/50H05K 1/117H05K 2201/0311H05K 2201/1031H05K 2201/10409
59
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.

Claims

exact text as granted — not AI-modified
1 - 20 . (canceled) 
     
     
         21 . An electrical system with at least two printed circuit boards, comprising:
 a first printed circuit board (PCB) with at least one electrical contact;   a second PCB with at least one electrical contact;   at least one guide coupled to the first PCB that is able to secure the first PCB against the second PCB; and   an electrical connection formed between the at least one electrical contact of the first PCB and the at least one electrical contact of the second PCB by solder paste.   
     
     
         22 . The electrical system of  claim 21 , where the at least one contact of the first PCB is a microstrip contact line extending to an edge of the vertical PCB and wrapping around the edge. 
     
     
         23 . The electrical system of  claim 21 , where the at least one contact of the first PCB is a ground pad that is wrapped around an edge of the first PCB. 
     
     
         24 . The electrical system of  claim 21 , where the at least one contact of the second PCB is a ground pad. 
     
     
         25 . The electrical system of  claim 21 , where the first PCB has at least one antenna formed on or in it. 
     
     
         26 . A method of connecting a first printed circuit board (PCB) with a second PCB, comprising:
 forming a contact on the first PCB;   forming a contact on the second PCB;   positioning the contact on the first PCB in a physical connection with the contact on the second PCB; and   applying solder paste at the physical connection.   
     
     
         27 . The method of connecting a first PCB with a second PCB of  claim 26 , further including the step of solidifying the solder paste. 
     
     
         28 . The method of connecting a first PCB with a second PCB of  claim 26 , where positioning the contact on the first PCB in physical connection with the contact on the second PCB further includes coupling at least one guide to the first PCB that is able to secure the first PCB against the second PCB. 
     
     
         29 . The method of connecting a first PCB with a second PCB of  claim 26 , where forming a contact on the first PCB further includes affixing a microstrip on the first PCB. 
     
     
         30 . The method of connecting a first PCB with a second PCB of  claim 26 , where forming a contact on the first PCB further includes affixing a ground pad on the first PCB that is wrapped around an edge of the first PCB. 
     
     
         31 . The method of connecting a first PCB with a second PCB of  claim 26  where forming a contact on the second PCB further includes affixing a ground pad on the second PCB. 
     
     
         32 . The method of connecting a first PCB with a second PCB of  claim 26 , where the first PCB has at least one antenna formed on or in it.

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