Fuse element

Abstract

A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

1 - 42 . (canceled) 
     
     
         43 . A fuse element for use in electric and/or electronic circuits co meted by multilayer technology and other technology comprising a printed circuit board carrier material for use in the multilayer technology and other technology, coated with a metal or metal alloy defining a fuse and being formed by photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, wherein the printed circuit board carrier material, on which the fuse can be formed, comprises at least a high-temperature-stable, electrically insulating material having a coefficient of thermal expansion that varies corresponding with the coefficient of the thermal expansion of the metal or metal alloy from which the fuse is formed. 
     
     
         44 . The fuse element as defined by  claim 43 , wherein the metal material or metal alloy from which the fuse is generated is copper or a copper alloy. 
     
     
         45 . The fuse element as defined by  claim 43 , wherein the metal material or the metal alloy from which the fuse is generated is silver or a silver alloy. 
     
     
         46 . The fuse element as defined by  claim 43 , wherein the fuse is formed from a plurality of layers of metal or a metal alloy. 
     
     
         47 . The fuse element as defined by  claim 46 , wherein an outer layer of the plurality of layers is formed of silver or a silver alloy. 
     
     
         48 . The fuse element as defined by  claim 43 , wherein the printed circuit board substrate material comprises at least one heat-hardened, glass-fiber reinforced hydrocarbon/ceramic laminate. 
     
     
         49 . The fuse element as defined by  claim 43 , wherein the printed circuit board substrate material comprises at least one ceramic-enriched, temperature-conducting epoxy resin laminate. 
     
     
         50 . The fuse element as defined by  claim 43 , wherein for the first printed circuit board substrate, on which the fuse is provided in the metal or the metal alloy, a second printed circuit board substrate resting adjacent to the first printed circuit board substrate is provided. 
     
     
         51 . The fuse element as defined by  claim 43 , wherein in the vicinity of the site of a first printed circuit board substrate, on which the fuse is formed in the metal or the metal alloy, a void is provided in a second printed circuit board substrate, resting adjacent to the first printed circuit board substrate, the void being in the form of a recess in the second printed circuit board substrate. 
     
     
         52 . The fuse element as defined by  claim 43 , wherein in the vicinity of the site of a printed circuit board substrate, on which the fuse is formed in the metal or the metal alloy, one void each is provided both in a second printed circuit board substrate resting adjacent on the first printed circuit board substrate and in the vicinity of the site of the first printed circuit board substrate on which the fuse is provided, the voids being in the form of respective recesses. 
     
     
         53 . The fuse element as defined by  claim 51 , wherein the void or voids are closed off with a layer on the side facing away from the fuse. 
     
     
         54 . The fuse element as defined by  claim 53 , wherein the layer is a membrane. 
     
     
         55 . The fuse element as defined by  claim 53 , wherein the layer is a flexible layer. 
     
     
         56 . The fuse element as defined by  claim 53 , wherein the layer is a foil-like structure. 
     
     
         57 . The fuse element as defined by  claim 53 , wherein the layer has an additional metal layer. 
     
     
         58 . The fuse element as defined by  claim 43 , wherein the printed circuit board substrate, at least in the vicinity of the melting part of the fuse, has a plurality of through-holes. 
     
     
         59 . The fuse element as defined by  claim 43 , wherein the metal or metal alloy forming the melting part of the fuse has a plurality of through-holes. 
     
     
         60 . The fuse element as defined by  claim 51 , wherein at least one void is at least partly filled with an insulating means. 
     
     
         61 . The fuse element as defined by  claim 53 , wherein the face in which the layer is provided essentially determines the face of the body of the fuse in the plane. 
     
     
         62 . The fuse element as defined by  claim 53 , wherein at least the thickness of two printed circuit board substrates resting on one another, plus the thickness of the conductor forming the melting part of the fuse element, determines the thickness of the body of the fuse element. 
     
     
         63 . The fuse element as defined by a  claim 43 , wherein both ends of the melting part of the fuse element are provided with connection contacts. 
     
     
         64 . The fuse element as defined by  claim 63 , wherein in a three-dimensional embodiment of the body forming the fuse element, the connection contacts are connected to the ends of the melting part of the fuse by means of plated through-hole connections.