Aluminum plating apparatus and method for producing aluminum film using same
Abstract
The invention offers an aluminum-plating apparatus that can satisfactorily form an aluminum plating even on the surface of a base body that has a surface on which an insulating or poorly conductive metal oxide film or the like is formed. The aluminum-plating apparatus electrodeposits aluminum onto a base body by conveying the base body in a plating bath. The plating bath is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in this order from the upstream side in the conveying direction for the base body. In the first electrolysis chamber, a negative electrode provided in the chamber is electrically connected with the base body such that the base body acts as a positive electrode. In the second electrolysis chamber, a positive electrode provided in the chamber is electrically connected with the base body such that the base body acts as a negative electrode.
Claims
exact text as granted — not AI-modified1 . An aluminum-plating apparatus for electrodepositing aluminum onto a base body by conveying the base body in a plating bath, the apparatus having a feature in that:
the plating bath is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in this order from the upstream side in a direction that the base body is conveyed; in the first electrolysis chamber, which is provided with a negative electrode, the negative electrode is electrically connected with the base body in such a way that the base body acts as a positive electrode; and in the second electrolysis chamber, which is provided with a positive electrode, the positive electrode is electrically connected with the base body in such a way that the base body acts as a negative electrode.
2 . The aluminum-plating apparatus as defined by claim 1 , the apparatus comprising, at the upstream side of an entrance of the first electrolysis chamber, a first electricity supply roller that gives an electric potential to the base body and concurrently conveys the base body.
3 . The aluminum-plating apparatus as defined by claim 1 , the apparatus comprising, at the downstream side of an exit of the second electrolysis chamber, a second electricity supply roller that gives an electric potential to the base body and concurrently conveys the base body.
4 . The aluminum-plating apparatus as defined by claim 1 , wherein the plating bath contains a molten-salt bath composed mainly of aluminum chloride.
5 . The aluminum-plating apparatus as defined by claim 1 , wherein the base body is a sheet composed of a resin formed body having a three-dimensional network structure that has undergone conductive treatment.
6 . An aluminum-plating apparatus, comprising two or more aluminum-plating apparatuses each as defined by claim 1 ;
the apparatuses being positioned in series in a direction that the base body is conveyed.
7 . An aluminum-plating apparatus, comprising an aluminum-plating apparatus:
that is positioned at a preceding positon of the aluminum-plating apparatus as defined by claim 1 , the preceding positon being the most upstream position in a direction that the base body is conveyed; that electrodeposits aluminum onto the base body by conveying the base body in a plating bath; and that has a feature in that in the plating bath, which is provided with a positive electrode, the positive electrode is electrically connected with the base body in such a way that the base body acts as a negative electrode.
8 . A method of producing an aluminum film, the method electrodepositing aluminum onto a base body using the aluminum-plating apparatus as defined by claim 1 .Join the waitlist — get patent alerts
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