US2015211143A1PendingUtilityA1

Aluminum plating apparatus and method for producing aluminum film using same

Assignee: SUMITOMO ELECTRIC INDUSTRIESPriority: Sep 5, 2012Filed: Jun 13, 2013Published: Jul 30, 2015
Est. expirySep 5, 2032(~6.1 yrs left)· nominal 20-yr term from priority
C25D 17/06C25D 5/56C25D 3/66C25D 3/44C25D 7/0621C25D 7/0642C25D 3/665C25D 5/44C25D 5/003
53
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Claims

Abstract

The invention offers an aluminum-plating apparatus that can satisfactorily form an aluminum plating even on the surface of a base body that has a surface on which an insulating or poorly conductive metal oxide film or the like is formed. The aluminum-plating apparatus electrodeposits aluminum onto a base body by conveying the base body in a plating bath. The plating bath is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in this order from the upstream side in the conveying direction for the base body. In the first electrolysis chamber, a negative electrode provided in the chamber is electrically connected with the base body such that the base body acts as a positive electrode. In the second electrolysis chamber, a positive electrode provided in the chamber is electrically connected with the base body such that the base body acts as a negative electrode.

Claims

exact text as granted — not AI-modified
1 . An aluminum-plating apparatus for electrodepositing aluminum onto a base body by conveying the base body in a plating bath, the apparatus having a feature in that:
 the plating bath is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in this order from the upstream side in a direction that the base body is conveyed;   in the first electrolysis chamber, which is provided with a negative electrode, the negative electrode is electrically connected with the base body in such a way that the base body acts as a positive electrode; and   in the second electrolysis chamber, which is provided with a positive electrode, the positive electrode is electrically connected with the base body in such a way that the base body acts as a negative electrode.   
     
     
         2 . The aluminum-plating apparatus as defined by  claim 1 , the apparatus comprising, at the upstream side of an entrance of the first electrolysis chamber, a first electricity supply roller that gives an electric potential to the base body and concurrently conveys the base body. 
     
     
         3 . The aluminum-plating apparatus as defined by  claim 1 , the apparatus comprising, at the downstream side of an exit of the second electrolysis chamber, a second electricity supply roller that gives an electric potential to the base body and concurrently conveys the base body. 
     
     
         4 . The aluminum-plating apparatus as defined by  claim 1 , wherein the plating bath contains a molten-salt bath composed mainly of aluminum chloride. 
     
     
         5 . The aluminum-plating apparatus as defined by  claim 1 , wherein the base body is a sheet composed of a resin formed body having a three-dimensional network structure that has undergone conductive treatment. 
     
     
         6 . An aluminum-plating apparatus, comprising two or more aluminum-plating apparatuses each as defined by  claim 1 ;
 the apparatuses being positioned in series in a direction that the base body is conveyed.   
     
     
         7 . An aluminum-plating apparatus, comprising an aluminum-plating apparatus:
 that is positioned at a preceding positon of the aluminum-plating apparatus as defined by  claim 1 , the preceding positon being the most upstream position in a direction that the base body is conveyed;   that electrodeposits aluminum onto the base body by conveying the base body in a plating bath; and   that has a feature in that in the plating bath, which is provided with a positive electrode, the positive electrode is electrically connected with the base body in such a way that the base body acts as a negative electrode.   
     
     
         8 . A method of producing an aluminum film, the method electrodepositing aluminum onto a base body using the aluminum-plating apparatus as defined by  claim 1 .

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