Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit Substrate

Abstract

An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced.

What is claimed is: 
     
         1 . An apparatus for placing and mounting solder balls on an integrated circuit substrate comprising: a fixture, a vacuuming device, a guiding plate, and a storage tank; wherein
 the fixture includes a plurality of first grooves defined therein, and each first groove has an upper opening and a lower opening, a diameter of the upper opening is less than that of the lower opening, and each first groove is provided to receive a respective one of a plurality of solder balls, and the fixture also includes a plurality of through holes formed therein and located on the plurality of first grooves;   the vacuuming device is disposed over the fixture and includes a vacuum chamber arranged therein and having a plurality of connecting orifices for corresponding to the plurality of through holes of the fixture, the vacuum chamber has an air pore defined on a central portion thereof so that when air is drawn out of the vacuum chamber via the air pore, the plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released, the vacuuming device includes a turning assembly fixed on two sides thereof so as to leftward or rightward rotate the fixture, the vacuuming device, the guiding plate, and the storage tank over 180 degrees;   the guiding plate is secured below the fixture and includes a plurality of apertures for corresponding to the plurality of first grooves of the fixture, and each aperture is used to receive the respective one of the plurality of solder balls, the guiding plate also includes a plurality of second grooves defined therein and communicating with the plurality of apertures, and a diameter of a lower opening of each second groove is greater than that of each aperture;   the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls.